Devices, systems, and methods (a) receive a field material map that represents of a spatial distribution of a volume of a material over a rectangular region; (b) divide the rectangular region into two rectangular child regions along a division axis; (c) determine if the material volume in each rectangular child region is within a range of a specific volume; (d) for each rectangular child region that is not within the range of the specific volume, perform (b) for each rectangular child region as the rectangular region along a division axis that has been rotated by 90 degrees relative to the division axis that was used to generate the rectangular child region; (e) repeat (b)-(d) until all rectangular child regions meet the criteria in (c); and (f) output a drop pattern that includes one or more drop locations inside each rectangular child region that meets the criteria in (c).

The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of the substrate and the original, a measurement unit configured to measure, when performing the process, a positional shift amount between a mark provided on the original and a mark provided in each of the shot regions, and a control unit configured to control the process for the shot region so that after the process is performed successively for a plurality of first shot regions included in a first row, the process is performed successively for a plurality of second shot regions included in a second row adjacent to the first row.

An imprint device that can simply detect an abnormality such as dirt of a mold chuck is provided. The imprint device includes a holding mechanism configured to hold a mold, a mold shape correcting mechanism configured to modify a shape of the mold, a mold shape measuring unit configured to measure the shape of the mold, and a determination unit configured to determine whether there is dirt on a mold holding surface of the holding mechanism or the mold based on mold modification characteristics which are measured by the mold shape measuring unit with respect to target mold modification values in the mold shape correcting mechanism.

A detector that detects relative positions of a first object and a second object in directions different from each other on a predetermined plane, includes an illumination optical system configured to illuminate a first mark provided on the first object and a second mark provided on the second object, and a detection optical system configured to detect interference light of diffracted lights from the first mark and the second mark illuminated by the illumination optical system. A light intensity distribution is formed, on a pupil plane of the illumination optical system, to illuminate the first mark and the second mark from a direction tilted with respect to a normal of the predetermined plane. A pupil plane of the detection optical system allows the interference light to pass through and block at least a part light other than the interference light.

The present invention provides an imprint method of forming a pattern of an imprint material on a shot region of a substrate using a mold, the method comprising: supplying the imprint material onto the shot region so as to arrange droplets of the imprint material in arrangement patterns different from each other between a first partial region and a second partial region adjacent to each other in the shot region; performing alignment between the mold and the shot region after it is started to bring the mold and the imprint material into contact with each other; performing preliminary curing of irradiating the imprint material on the shot region with light to increase a viscoelasticity of the imprint material before the alignment is completed; and performing main curing of curing the imprint material on the shot region after the alignment is completed.

Provided is a position measurement apparatus in which a measurement error in a target is reduced. A position measurement apparatus measuring a position of a target includes an illumination unit configured to illuminate the target with illumination light including light of a first wavelength and light of a second wavelength different from the first wavelength, a measurement unit configured to measure the position of the target by detecting light from the target illuminated with the illumination light, and a control unit configured to adjust a ratio of a light intensity of the first wavelength to a light intensity of the second wavelength such that a measurement error varying depending on the position of the target in the measurement unit is reduced.

A method of determining information indicating an arrangement of an imprint material in an imprint apparatus, includes repeating, by the imprint apparatus, a process of arranging an imprint material on a substrate in accordance with a provisional arrangement, forming a pattern by curing the imprint material in a state in which a mold is brought into contact with the imprint material, and changing the provisional arrangement based on the pattern, until quality of the pattern satisfies a predetermined condition, and determining, by the imprint apparatus, information indicating the arrangement of the imprint material based on the latest provisional arrangement at a stage where the quality of the pattern satisfies the predetermined condition.

Reducing an overlay error in nanoimprint lithography includes forming an imprinted substrate having pairs of corresponding peripheral overlay marks and corresponding central overlay marks on the imprinted substrate. An in-plane overlay error is assessed based on relative positions of corresponding central overlay marks, and a combined overlay error is assessed based on relative positions of corresponding peripheral overlay marks. A difference between the combined overlay error and the in-plane overlay error is assessed to yield an adjusted overlay error for each pair of corresponding peripheral overlay marks. The adjusted overlay error for each pair of corresponding peripheral overlay marks is compared with overlay errors associated with known out-of-plane orientation parameters of the template with respect to the substrate, and corrected out-of-plane orientation parameters are selected to reduce an expected out-of-plane overlay error of a subsequent imprinted substrate associated with out-of-plane orientation parameters of the template with respect to the substrate.

The present invention provides an imprint apparatus for forming a pattern in an imprint material on a substrate using an original, comprising: an image capturing unit configured to capture an image of the substrate; and a processor configured to perform, based on fine-detection marks and rough-detection marks in the image obtained by the image capturing unit, an alignment process of the original and the substrate in forming the pattern in the imprint material, and overlay inspection of the substrate and the pattern formed in the imprint material, wherein the processor is configured to change, between the alignment process and the overlay inspection, a rough-detection mark group to be used to specify positions of fine-detection marks in the image obtained by the image capturing unit.

The present invention provides a processing apparatus comprising: a generator configured to generate, based on image data of a measurement target, position information of the measurement target in a first direction; and a determinator configured to determine, based on a feature quantity of the image data related to a second direction different from the first direction, confidence of the position information of the measurement target generated by the generator.