An apparatus and method for manufacturing a workpiece using optical dimensioning. The apparatus comprises a tool configured to alter at least one feature of the workpiece. An imaging system is coupled to the tool and defines an optical axis. The imaging system is configured to capture a plurality of images of the at least one feature of the workpiece. A controller comprises one or more processors. The controller is configured to analyze the plurality of images to determine measured dimensions of the at least one feature of the workpiece. The controller is further configured to define a three-dimensional path for operating the tool by applying a predefined modification to the measured dimensions of the at least one feature of the workpiece.

A method includes receiving data indicative of properties of a substrate support from one or more sensors of a removable sensor assembly disposed proximate to the substrate support. The method further includes providing data based on the data indicative of properties of a substrate support to a physics-based model of the substrate support. The method further includes receiving predicted performance data of the substrate support from the physics-based model.

A method includes initiating a connection with a semiconductor manufacturing system. The method further includes generating a set of tool data items associated with the semiconductor manufacturing system. The method further includes providing a graphical user interface (GUI) presenting the set of tool data items associated with the semiconductor manufacturing system and receiving and via the GUI, user input selecting one or more of the tool data items. The method further includes adding configuration data associated with one or more of the tool data items to a data collection plan. The method further includes validating the configuration data by locating, in the manufacturing system, a configuration data file associated with the configuration data. The method further includes executing one or more data collection operations based on the data collection plan.

A method includes receiving first data indicative of a range of values of a quality parameter of a type of manufacturing chamber component. Each value in the range of values meets one or more threshold criteria. The method further includes providing the first data to a physics-based model of a manufacturing chamber. The method further includes receiving, from the physics-based model, second data indicating a relationship between values of the quality parameter and predicted conditions in the manufacturing chamber. The method further includes determining, based on the relationship between values of the quality parameter and the predicted conditions, whether a new manufacturing chamber component of the manufacturing chamber component type is to be installed in the manufacturing chamber.

A method includes receiving first sensor data associated with a first iteration of a first recipe operation of a substrate processing recipe. The method further includes determining disturbance data, the disturbance data being a difference between the first sensor data and first setpoint data of the first recipe operation. The method further includes determining, based at least in part on the disturbance data, a first actuation value associated with one or more components of a processing chamber. Actuation of the one or more components according to the first actuation value compensates for the disturbance data. The method further includes causing the actuation of the one or more components based on the first actuation value during a subsequent iteration of the first recipe operation of the substrate processing recipe to compensate for the disturbance data.

Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

In one embodiment, a system includes a HMI module. The HMI module includes a first external application unit that has first external application unit. The first external application unit has a first interface for the HMI module. The HMI module further includes a second external application unit that has a second interface for the HMI module. The HMI module can correspond with both the first interface and the second interface.

A hemming path planning method and a hemming system are provided. The hemming path planning method includes the following steps. An initial contour data of a target is scanned to obtain. A first segment of the hemming path is planned according to the initial contour data. The first segment corresponds to a first bending angle. A second segment of the hemming path is planned according to the initial contour data and an expected springback amount related to the first bending angle. The second segment corresponds to a second bending angle. The first segment and the second segment are combined to obtain a continuous hemming path.

One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the substrate and a processing solution saving mode that saves a processing solution in at least one of processing tanks. The apparatus for processing the substrate determines whether or not the apparatus for processing the substrate is in a slack period that has a small demand output by the apparatus for processing the substrate, based on a rate-controlling point that limits a processing speed of the entire apparatus for processing the substrate, and sets the transfer time table to the processing solution saving mode when it is determined that the apparatus for processing the substrate is in the slack period, while setting the transfer time table to the ordinary mode when it is determined that the apparatus for processing the substrate is not in the slack period.

A machine tool controlled by a numerical controller is provided with an additional-axis composed of a tilting table and a rotary table. The controller displays, in a display section thereof, a diagram representative of an actual state in which an additional shaft is mounted so that an operator can select how to mount the additional shaft on the machine tool and collectively set parameters based on the selection.