A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.

The present invention provides a quick processing system and method for SMT equipment, that is: firstly read PCB design files and BOM files inputted, and generate core data including text data and graphic data of all components to be assembled; then search the component data matched with each component to be assembled in the local database on basis of the core data, and link the found component information with the corresponding component to be assembled, and mark the component information as an available component, and create component information on basis of the core data of the component to be assembled, and stored to the local database, then mark the component information as an available component, and recover the component information on basis of the graphic data in the core data as an error is checked out; finally output the validated component information to the SMT equipment system.

A substrate processing system includes a substrate processing apparatus configured to process a substrate, and a management device configured to display specified information transmitted from the substrate processing apparatus on a display unit. The substrate processing apparatus includes a processing environment measuring unit configured to measure information on a substrate processing environment according to time and a trouble information notifying unit configured to notify information on a trouble of the substrate processing apparatus. The management device includes a storage unit configured to store measurement information measured by the processing environment measuring unit and notification information notified by the trouble information notifying unit. The display unit is configured to display the measurement information and the notification information which are stored in the storage unit and correlated with each other.

A substrate processing apparatus includes a device management controller including a parts management control part configured to monitor the state of parts constituting the apparatus, a device state monitoring control part configured to monitor integrity of device data obtained from an operation state of the parts constituting the apparatus, and a data matching control part configured to monitor facility data provided from a factory facility to the apparatus. The device management controller is configured to derive information evaluating the operation state of the apparatus based on a plurality of monitoring result data selected from a group consisting of maintenance timing monitoring result data acquired by the parts management control part, device state monitoring result data acquired by the device state monitoring control part, and utility monitoring result data acquired by the data matching control part.

A method of manufacturing a semiconductor device includes defining a sampling plan in a process control system. Measurement values are obtained at the first number N of the sample points. The first number of measurement values are modelled using a wafer model to generate a first set of coefficients according to a reference model. A second number M of the first number N of sample points is randomly selected. The second number M of measurement values obtained at the second number M of sample points is modelled using the wafer model to generate a second set of coefficients according to a phase_1 model. One of the M sample points is randomly replaced by one of the N−M sample points to obtain a subsample. The measurement values of the subsample are modelled using the wafer model to generate a third set of coefficients according to a phase_2 model.

A substrate processing apparatus includes a device management controller including a parts management control part configured to monitor the state of parts constituting the apparatus, a device state monitoring control part configured to monitor integrity of device data obtained from an operation state of the parts constituting the apparatus, and a data matching control part configured to monitor facility data provided from a factory facility to the apparatus. The device management controller is configured to derive information evaluating the operation state of the apparatus based on a plurality of monitoring result data selected from a group consisting of maintenance timing monitoring result data acquired by the parts management control part, device state monitoring result data acquired by the device state monitoring control part, and utility monitoring result data acquired by the data matching control part.

A substrate processing system includes a monitored data receiving unit receiving a plurality of types of monitored data; a temporary memory unit periodically storing the monitored data; a monitored data rate detection unit detecting, as a monitored data rate, a total number of times each type of monitored data changes during a first time period by more than a predetermined amount; a monitored data writing allocation unit allocating a storing frequency to each type of monitored data based on the monitored data rate and an upper limit; a monitored data writing unit writing the monitored data to the temporary memory unit during the second time period based on the storing frequency; an accumulative memory unit storing the monitored data for a plurality of periods; and an accumulative data writing unit reading the monitored data for every third time period and storing the monitored data in the accumulative memory unit.

A system for determining the cause of an abnormality in a semiconductor manufacturing process includes an abnormality mode determination module, a selection module, and a root cause analysis module. The abnormality mode determination module is used to determine the similarity between wafer bin maps containing the abnormal data. When the similarity among the wafer maps is higher than a reference value, the selection module executes the steps of: determining a bad lot based on the wafer maps where the similarity is higher than the reference value; determining a time span within which the bad lot is generated; selecting other bad lots occurring in the time span and satisfying a failure model; selecting a good lot based on a fixed lot interval. The root cause analysis module is used to execute the steps of calculating the correlation among data to obtain confidence indexes.

A user interface for designing, configuring and/or editing a control flow representing a control strategy associated with a semiconductor manufacturing process, the user interface including: a library of control elements having at least a control element representing a task of simulation and each control element being selectable by a user; a control flow editor configured to organize the control elements into a control flow representing the control strategy; and a communication interface for communicating the control flow to a calculation engine configured to evaluate the control flow.

A computer device is programmed to store a model for converting shape maps to simulate a portion of an assembly line, receive scan data of a first inspection of a product being assembled, generate a shape map from the scan data of the first inspection, execute the model using the shape map as an input to generate a final shape map of the product, compare the final shape map to one or more thresholds, determine if the final shape map exceeds at least one of the one or more thresholds, and if the determination is that the final shape map exceeds at least one of the one or more thresholds, cause the first device to be adjusted.