An intelligent processing modulation system comprises: a detector detecting the condition of the processing equipment before the process for processing a raw material into a product begins; a data storage recording the information of the product; a basic database storing the information of the detector and the data storage corresponding to the product and the condition of the product for each time the process is completed; a mode database receiving the information of the detector, the data storage and the basic database and setting up the processing model; a processing equipment operating according to the parameters of the processing model received by the processing information manager; a processing information manager modifying the processing model promptly according to the result of the product in order to improve the yield rate of the product.

An inspection management system manages, in a production line for a product including a plurality of processes, a final inspection for a product finished through the plurality of processes and a plurality of intermediate inspections before the final inspection. The production line includes a plurality of manufacturing apparatuses and a plurality of inspection apparatuses corresponding to the plurality of processes. The inspection management system includes an inspection data obtainer, an inspection result obtainer, and an inspection setting supporter that generates an inspection record diagram showing, as information about an inspection item in one of the plurality of intermediate inspections, a presence or an absence of a product determined defective in the final inspection and information identifying whether the product determined defective in the final inspection is determined defective under an inspection item in another of the plurality of intermediate inspections, and displays the inspection record diagram.

Systems and methods for controlling manufacturing processes for microelectronic components are provided. In an exemplary embodiment, a method includes determining a specification range for a desired parameter. The microelectronic component is processed in a manufacturing tool, and a trace data set is recorded during the processing. An estimated trace data parameter is determined with the trace data set, and a first measured value of the microelectronic component is measured in a measurement tool. An estimated desired parameter is determined using the first measured value and the estimated trace data parameter, and the manufacturing process is adjusted when the estimated desired parameter is outside of the specification range.

Systems and methods of inspecting a manufactured part include creating a computer model of the part with a desired model contour having a model feature at a desired location. The manufactured part is scanned to obtain scanned data indicative of a manufactured surface formed in a manufactured contour and having a manufactured feature at an actual location on the manufactured surface. The computer model is modified using modeled reaction forces so that the model contour matches the manufactured surface. A determination whether the manufactured part is acceptable is based on a comparison of the actual location of the manufactured feature with and the desired location of the model feature with the model surface in the modified model contour. Additionally or alternatively, the reaction forces are compared with a reaction force threshold to determine whether the manufactured part requires reworking.

A manufacturing system is disclosed herein. The manufacturing system includes one or more stations, a monitoring platform, and a control module. Each station of the one or more stations is configured to perform at least one step in a multi-step manufacturing process for a component. The monitoring platform is configured to monitor progression of the component throughout the multi-step manufacturing process. The control module is configured to dynamically adjust processing parameters of each step of the multi-step manufacturing process to achieve a desired final quality metric for the component.

A method and system for linking sensor data to metrology data and metrology data to sensor data is described herein. In one embodiment, a user selection of metrology data for a product is received, related process tool fault detection summary for the selected metrology data for the product is presented, a user selection of a process tool from the process tool fault detection summary is received, and related fault detection details for the selected process tool are presented.

Systems and methods are provided for monitoring equipment in a semiconductor manufacturing facility. A processing device maintains baseline measurement record generated from measurements performed by a plurality of tools over a first time range. A measurement record is received, the measurement record corresponding to a measurement performed on a wafer, the wafer having been processed by a first tool of the plurality of tools. The measurement record is stored in a drift candidate table corresponding to a second time range. A determination is made as to whether the measurement record satisfy a set of excursion rules in view of the drift candidate table, and, in response to the determination, the measurement record is stored in an alert table.

A production management system 100 includes an operating state acquisition apparatus 20a and a production management apparatus 10. The operating state acquisition apparatus 20a includes a detector 21a that is retrofitted to be mounted on a production equipment 31 disposed on a manufacturing line L1 or retrofitted to be disposed in a vicinity of the production equipment 31, and which outputs a detection signal indicating an operating state of the production equipment 31, and includes a transmitter 22a that transmits the detection signal. The production management apparatus 10 includes a generator for generating information on production state of the manufacturing line L1 by use of the detection signal received from the operating state acquisition apparatus 20a, and includes a display device for displaying the generated information on production state.

A diagnostic apparatus includes: a receiver to receive, from a diagnosis target device, context information corresponding to a current operation on the target device and tool information regarding a tool being used for the current operation on the target device, the context information corresponding to the current operation being one of a plurality of items of context information that have been determined by respective types of a plurality of types of operation applicable to the target device; and circuitry to obtain detection information of a physical quantity varying with the current operation on the target device, and to determine a level of degradation of the tool being used, using the detection information and a model corresponding to a combination of the received context information and the received tool information, the model being specified from one or more models respectively corresponding to available combinations of context information and tool information using the received combination of context information and tool information.

A system and method monitor and/or diagnose the operation of a production line of an industrial plant which is controlled by an automation system. The system includes a remote data processing server, which is installed outside of the industrial plant. The remote data processing server is configured to receive a digital input signal reflecting at least one control input signal and a digital output signal reflecting a second operational state, to determine at least first and second modeled states corresponding to the at least first and second operational states, respectively, by inputting the digital input and the digital output signals to a digital observer model of the production line and the automation system and by processing the digital observer model, and to forward the first and second modeled states to an output interface from where they can be accessed by modeling and/or diagnosing modules.