A system and method for material handling are disclosed. The system includes a platform for receiving a plurality of articles, a plurality of sorting bins that each correspond to an article type, an object recognition system for identifying the article on the platform and categorizing the article by a specific article type, and an article engagement assembly. The object recognition system includes a 3D detector for detecting the article and a database containing data on characteristics of article types. The 3D detector is arranged to capture at least one two-dimensional image, and at least one depth image of the article. The article engagement assembly engages and delivers the article to the corresponding sorting bin. The object recognition system is arranged to identify the article based upon the data within the database and instructs the article engagement assembly to engage and place the article in the sorting bin.

According to one embodiment, a package stocker is configured to store a plurality of semiconductor packages each including one or more nonvolatile memory dies. A drive includes at least one socket on which a semiconductor package is able to be detachably mounted. A host apparatus, which is communicatively connected to the drive, reads/writes data from/to the one or more nonvolatile memory dies of the semiconductor package mounted on the socket. When a first semiconductor package is not mounted on the socket, the host apparatus causes a package transport device to transport the first semiconductor package to the drive and to mount the first semiconductor package on the socket.