A material processing path selection method includes calculating a plurality of candidate material processing paths, determining a bottleneck process tank, and for each of the plurality of candidate material processing paths, calculating a bottleneck process tank utilization rate to select a candidate material processing path with a highest bottleneck process tank utilization rate in the plurality of candidate material processing paths as a target material processing path. The bottleneck process tank is a process tank having a highest use frequency among all process tanks, A use frequency of the process tank is equal to a total process time length of all materials that need to be transferred to the process tank divided by a number of all the materials that need to be transferred to the process tank.

A method and a control device for the throughput-optimized production of printed circuit boards on a pick-and-place line is provided. Further provided is a method for the throughput-optimized production of printed circuit boards on a pick-and-place line, wherein: the printed circuit boards are divided into groups known as clusters; each cluster is produced using one set-up; the set-up is realized by changing tables that can be attached to the pick-and-place line, each changing table having at least one feed device for keeping ready stocks of components; a quantity of changing tables needed for each set-up is referred to as a changing table set and an empty changing table set includes changing tables having feed devices that are empty.

A production data creation device includes an input unit and a setting unit. The input unit receives an input of one application from among a plurality of applications displayed on a screen. The setting unit sets one or more operation parameters used by a component mounter to mount a component on a board, on the basis of the input application.

A mounted board manufacturing system that manufactures a mounted board, which is a board mounted with a component. The mounted board manufacturing system includes: at least one component loading device that executes a component loading operation for loading the component on a board; a rule base with which at least one machine parameter for executing the component loading operation performed by the at least one component loading device can be calculated; an operation information aggregator that aggregates, for each component data, results of processing executed by the at least one component loading device, together with operation information; and a calculation processor that selects, as actual training data, component data corresponding to an operation result that exceeds a predetermined reference, from the operation information aggregator, and estimates at least one machine parameter of a new component, using the actual training data, the rule base, and basic information of the new component.

When a specification setting unit sets a specification of a lot number “k+1” after setting a specification of a lot number “k”, a mounting program selector performs a mounting program corresponding to the lot number “k”, and then selects a mounting program corresponding to the lot number “k+1” according to matching between a mounting number from the mounting program and a planned number of products of the lot number “k”. A printing program selector selects a printing program corresponding to the lot number “k”, and then selects a printing program corresponding to the lot number “k+1” according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number “k”. Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

A board production management device configured to manage a board production line including an initial notification section configured to issue notification information including at least one of a contents of an error cause or a contents of countermeasures when the error cause that requires countermeasures occurs at the board production line; and an escalation notification section configured to issue the notification information after escalating in a case in which the error cause is not resolved after a specified time has elapsed since the error cause occurred. Accordingly, because when the specified time has elapsed, a notification is issued as escalating the notifyee or escalating the contents of countermeasures to resolve error causes more effectively, and compared to conventional technology in which only re-notification of the occurrence of the error cause is performed, notification is performed more efficiently, enabling an error cause that requires countermeasures to be resolved more quickly.

There is provided a board work machine (a component mounting machine) including a data registration section for registering in advance multiple data (ultra-high precision data, high precision data, normal precision data) for each characteristic of a member constituting a base material for a circuit board in accordance with the type and characteristic of the member; a work performing section (a part camera) for performing work using the member or performing work on the member while selecting one item of data from the multiple data for reference; and an automatic data switching section for automatically switching among the multiple member data that the work performing section refers to in accordance with the performing situation of the work performed by the work performing section.

Various techniques are provided to implement back-end processing systems and methods for device identification. In one example, a method includes receiving fabrication data associated with a die element. The die element has an integrated circuit fabricated according to a design defined by a mask set. The method further includes creating, by the integrated circuit, a seed value based on a characteristic of the integrated circuit. The method further includes producing, by the integrated circuit, an identifier for the die element based on the fabrication data and the seed value. Related devices and systems are provided.

A work management device manages a board work line having multiple board work machines for performing work on a board. The work management device includes a problem detection section configured to detect that a problem has occurred in any of the multiple board work machines; a handling method database configured to accumulate handling methods for problems; an updating section configured to update handling methods for problems at any time; and a work instruction section configured to extract and indicate to an operator a handling method for a problem from the handling method database when the problem detection section detects that the problem has occurred.