A driving apparatus is disclosed which has a movable part, a measuring device measuring a position of the movable part, two actuators respectively generating two thrusts which have a common axis of action thereof with respect to the movable part, and a controller that controls the position by the two actuators based on output of the measuring device. The controller obtains information of at least one of a thrust constant of one of the two actuators, a thrust constant of the other of the actuators, and rigidity of a member which supports the movable part with respect to the axis of action, based on a relationship between disturbance force estimated from thrust commands for the two actuators and an output of the measuring device in a case where the one actuator generates a thrust and the other actuator controls the position, and a thrust command for the one actuator.

The invention relates to a control system comprising a controller arranged to provide an output signal on the basis of an input signal. The controller comprises a linear integrator, a linear gain and a selector. The linear integrator is arranged to provide a first control signal. The linear gain is in parallel to the linear integrator and is arranged to provide a second control signal. The selector is arranged to switch between an integrator mode in which the first control signal is used as the output signal of the controller and a gain mode in which the second control signal is used as the output signal of the controller. The selector is arranged to switch to the integrator mode when the value of the second control signal passes zero, and to switch to the gain mode when: eu<k.sub.h.sup.−1u.sup.2, wherein e is the input signal of the controller, u is the output signal of the controller, and k.sub.h is the gain of the linear gain.

Several embodiments of photolithography systems and associated methods of overlay error correction are disclosed herein. In one embodiment, a method for correcting overlay errors in a photolithography system includes measuring a plurality of first overlay errors that individually correspond to a microelectronic substrate in a first batch of microelectronic substrates. The method also includes determining a relationship between the first overlay errors and a first sequence of the microelectronic substrates in the first batch. The method further includes correcting a second overlay error of individual microelectronic substrates in a second batch based on a second sequence of the microelectronic substrates in the second batch and the determined relationship.

In an example, a method includes receiving, by at least one processor, object model data, the object model data describing at least part of an object to be generated in additive manufacturing. Pattern data is also received, wherein the pattern data describes a pattern of variable opacity intended to be formed internally to the object. Object generation instructions for generating an intermediate layer of the object comprising the pattern of variable opacity may be determined by at least one processor.

In an example, a method includes operating, by a processor, on object model data. The object model data describes at least part of an object to be generated in additive manufacturing. The method also includes determining, by a processor, pattern data. The pattern data comprising areas of variable reflectance intended to be formed on a portion of the object. The method includes determining, by a processor, object generation instructions to apply a fusing agent to at least part of a layer of build material corresponding to the portion of the object in a density corresponding to the reflectance of the generated pattern data.

In an example, a method includes operating, by a processor, on object model data and operating, on a processor, on pattern data. The object model data describes at least part of an object to be generated in additive manufacturing and the pattern data describes an object pattern intended to be formed on at least a portion of the part of the object to be generated in additive manufacturing. The method includes determining, by a processor, control data to control a print agent applicator to apply a pattern of fusing agent onto a part of a layer of build material. The pattern of fusing agent comprises a fusing agent area and a gap area that lacks fusing agent. The gap area corresponds to the object pattern such that no fusing agent is applied to a part of the layer of build material that corresponds to the object pattern.

A method of simulating a resist pattern according to an exemplary embodiment includes a step (A) of calculating a latent image of a concentration of an active species in a resist film that has been radiated by a radioactive ray along a target pattern with respect to a radiation position of the radioactive ray, a step (B) of calculating a change rate of the concentration with respect to the radiation position at an edge of the target pattern on the basis of the latent image, a step (C) of calculating a probabilistic variation at the edge of the target pattern, and a step (D) of calculating a variation in pattern edge roughness from the change rate of the concentration and the probabilistic variation.

An information processing apparatus includes an acquisition unit configured to acquire a plurality of pieces of collected data collected in a state where lithographic processing is executed by a lithography apparatus for forming a pattern by applying a plurality of processing conditions, a classification unit configured to classify the acquired data based on the processing conditions, a judgement unit configured to judge that an abnormality has occurred in the acquired collected data by judging whether the collected data falls within an allowable range specified based on the processing conditions.

Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.

In an example, a method includes receiving, by at least one processor, object model data, the object model data describing at least part of an object to be generated in additive manufacturing. Pattern data is also received, wherein the pattern data describes a pattern of variable opacity intended to be formed internally to the object. Object generation instructions for generating an intermediate layer of the object comprising the pattern of variable opacity may be determined by at least one processor.