The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

This patent application relates to apparatus and methods for enhanced microelectronic device handling. Apparatus comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface. Related methods are also disclosed.

A component mounting system includes a component mounting line, a storage device, and a display device. The component mounting line is formed by connecting a plurality of mounting board manufacturing machines. The storage device is connected to the component mounting line via a network to acquire information from each of the plurality of mounting board manufacturing machines. The display device is connected to the storage device via the network and displays a progress status of set-up work executed when changing a type of a mounting board manufactured by the component mounting line based on information stored in the storage device.

A material management apparatus (management computer) includes a production plan acquirer that acquires production plan information including a type of a material (cream solder) for bonding a component to a substrate, the material being used for production of a mounting substrate obtained by mounting the component on the substrate; a material status acquirer that acquires material status information on the material preserved in a material preservatory which preserves an accommodating portion (solder pot) in which the material is accommodated; and a material preparation instructor that creates and transmits an instruction to prepare the accommodating portion to be put out from the material preservatory, based on the production plan information and the material status information.

A method for visually controlling a robot arm which is displaceable in a plurality of degrees of freedom, the robot arm carrying at least one displaceable reference point, includes the steps of: a) placing at least one camera so that a target point where the reference point is to be placed is contained in an image output by the at least one camera; b) displacing the robot arm so that the reference point is within the image; c) determining a vector which, in the image, connects the reference point to the target point; d) choosing one of the plurality of degrees of freedom, moving the robot arm by a predetermined standard distance in the one degree of freedom, and recording a standard displacement of the reference point within the image resulting from the movement of the robot arm; e) repeating step d) at least until the vector can be decomposed.

The mounting system includes a mounting device having a holding member, a moving work device for collecting or loading a holding member, and a moving work management device. The moving work management device comprises a management control section configured to create exchange order information including a collection order for collecting the holding member that the moving work device operates and/or a replenishment order for replenishing the holding member based on arrangement state information including the usage state of the holding member currently loaded to the mounting device and mounting condition information according to which the mounting device performs the mounting process.

A component mounting line control system controls a component mounting line. The component mounting line includes a component mounting device and a board retrieving unit. The component mounting line control system includes an acquirer and a controller. The acquirer acquires information from the board retrieving unit. The controller controls the component mounting device based on the information acquired by the acquirer. The controller lengthens a time taken for a manufacturing process in the component mounting device in a case where the acquirer acquires first warning information, which indicates that a board accommodation limit is about to be reached, from the board retrieving unit.

A production schedule creating method includes: acquiring production sequence information including a production sequence for producing a plurality of models of products and preparation work sequence information including a sequence of arrangement work of arranging members corresponding to the plurality of models on arrangement means which is attached to production equipment so as to arrange the members that are used for production of the products; acquiring arrangement means information including production arrangement means information that is information of the arrangement means attached to the production equipment and equipment detached arrangement means information that is information of an equipment detached arrangement means that is not attached to the production equipment; optimizing a production schedule obtained after a time point of acquisition of the arrangement means information, based on the production sequence information, the preparation work sequence information, and the arrangement means information.

A board production management device for managing a board production line including a solution memory section for linking and storing a problem event that may occur in a board production line and that requires a countermeasure operation, a solution to serve as the countermeasure operation, and a set authority level set for a worker who may implement the solution; an solution memory section for authenticating the authority level of a worker who implements the countermeasure operation; and a solution notification section for separately reporting, when a problem event occurs, an executable solution corresponding to a set authority level equal to or less than the authority level, and an unexecutable solution corresponding to a set authority level exceeding the authority level.