A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error, and cause the robot arm to place the object at the first station without at least one of the rotational error or the positional error.

A positioning system having a flat base comprising (i) a X-axis assembly having a X-axis linear actuator means arranged orthogonal to the Y-axis; (ii) a Y-axis assembly having a pair of Y-axis linear actuator means mounted onto the flat base forming a H-configuration; (iii) a Z-axis assembly having an aerostatic bearing mechanism that floats on thin film of externally pressurized air on top of the flat base; and a -axis actuator anchored from the X-axis to drive the Z-axis assembly which carries a workpiece, wherein the Z-axis assembly is rotated with the rotary axis for the -axis perpendicular to the flat base.

A fitting system is provided that includes a plurality of fitting lines for fitting printed circuit boards with electronic components. A method for allocating printed circuit boards to the fitting lines includes: (1) determining requirements for fitting each of a plurality of printed circuit boards with allocated components; and (2) allocating the printed circuit boards to fitting lines under predetermined conditions by integral linear programming. Equipment families are determined for the fitting lines on the basis of the allocation, and the allocation is repeated until a criterion has reached a predetermined threshold. The criterion is established on the basis of the number of equipment families of the fitting lines, where an equipment family includes a quantity of different components with which a fitting line may be fitted in order to fit a predetermined amount of printed circuit boards.

Described herein are methods and systems for chamber matching in a manufacturing facility. A method may include receiving a first chamber recipe advice for a first chamber and a second chamber recipe advice for a second chamber. The chamber recipe advices describe a set of tunable inputs and a set of outputs for a process. The method may further include adjusting at least one of the set of first chamber input parameters or the set of second chamber input parameters and at least one of the set of first chamber output parameters or the set of second chamber output parameters to substantially match the first and second chamber recipe advices.

Embodiments of the present invention provide a two-phase process for searching the root causes of the yield loss in the production line 100. In a first phase, process tools and their process tool types that are likely to cause the yield loss are identified, and in a second phase, the process parameters that are likely to cause the yield loss within the process tool types found in the first phase are identified. In each phase, two different algorithms can be used to generate a reliance index (RI.sub.k) for gauge the reliance levels of their search results.

In an approach to determining reliability test strategy, one or more computer processors receive a volume forecast for manufacturing one or more products. The one or more computer processors receive information describing the one or more products. The one or more computer processors retrieve reliability test requirements associated with the one or more products. The one or more computer processors retrieve reliability test capability of one or more reliability test vendors. The one or more computer processors determine, based, at least in part, on the volume forecast, the information describing the one or more products, the reliability test requirements, and the reliability test capability of the one or more reliability test vendors, a reliability test strategy.

Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.

Described herein are methods and systems for chamber matching in a manufacturing facility. A method may include receiving a first chamber recipe advice for a first chamber and a second chamber recipe advice for a second chamber. The chamber recipe advices describe a set of tunable inputs and a set of outputs for a process. The method may further include adjusting at least one of the set of first chamber input parameters or the set of second chamber input parameters and at least one of the set of first chamber output parameters or the set of second chamber output parameters to substantially match the first and second chamber recipe advices.

Since single and dual-arm tools behave differently, it is difficult to coordinate their activities in a hybrid multi-cluster tool that is composed of both single- and dual-arm tools. Aiming at finding an optimal one-wafer cyclic schedule for a treelike hybrid multi-cluster tool whose bottleneck tool is process-bound, the present work extends a resource-oriented Petri net to model such system. By the developed Petri net model, to find a one-wafer cyclic schedule is to determine robot waiting times. By doing so, it is shown that, for any treelike hybrid multi-cluster tool whose bottleneck tool is process-bound, there is always a one-wafer cyclic schedule. Then, computationally efficient algorithms are developed to obtain the minimal cycle time and the optimal one-wafer cyclic schedule. Examples are given to illustrate the developed method.

A method includes identifying first parameters of a first processing chamber of a semiconductor fabrication facility. The first parameters include first input parameters and first output parameters. The method further includes identifying second parameters of a second processing chamber of the semiconductor fabrication facility. The second parameters include second input parameters and second output parameters. The method further includes generating, by a processing device based on the first parameters and the second parameters, composite parameters comprising composite input parameters and composite output parameters. Semiconductor fabrication is based on the composite parameters.