A method of detecting a defect in an applied volume of material includes detecting a pressure discontinuity during dispensing the volume of material along a predetermined path on a substrate. The pressure discontinuity is indicative of the defect in the applied volume of material. The location of the defect along the predetermined path is function of a start time of the pressure discontinuity and the size of the defect is a function of a time duration of the pressure discontinuity. The method can further include determining whether or not to repair the defect as a function of the location and the size of the defect in the applied volume of material. The method includes repairing the defect by re-directing the material applicator to the location of the defect and dispensing additional material at the location of the defect.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A system for applying material to a substrate includes a nozzle, robot, actuator, sensor, and controller. The robot provides primary movement such that the nozzle traverses a predefined global bead path across and spaced apart from the substrate. The actuator provides secondary relative movement between the nozzle and substrate. The sensor senses a first location on the substrate that is spaced apart from a location where the nozzle deposits material by a distance based on a sensor response time and relative speed of the nozzle and substrate. The controller detects a feature of the substrate based on the data received from the sensor. The controller directs the actuator to provide the secondary relative movement such that a bead of material is applied to the substrate along a feature-relative bead path. The controller controls the actuator to provide the secondary relative movement based on the response time and the relative speed.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A robot control device that controls a robot and includes a processor which extracts a contour of a target based on an image of the target captured by an imaging device, generates a point sequence corresponding to the contour, and converts coordinates of the point sequence into coordinates in a robot coordinate system. Further, a robot control device that controls a robot includes a processor which extracts a contour of a target based on an image of the target captured by an imaging device and a predetermined instruction, generates a point sequence corresponding to the contour, and converts coordinates of the point sequence into coordinates in a robot coordinate system.

A method of depositing material on an electronic substrate with a dispensing system includes acquiring images of adjacent features, assigning programmed search boxes to edges of the features, identifying programmed edges of the features, for each feature identifying an intersection point of the programmed edges, determining a centerline from the intersection point, determining a midpoint of the, determining an intersect command for a dispense operation between the first component and the second component, and performing the dispense operation.

A method for calibrating a fluid dispensing system includes the steps of locating an external reference point with an optical sensor, moving a fluid dispenser to the external reference point, dispensing fluid with the fluid dispenser at the external reference point, locating the dispensed fluid with the optical sensor, calculating a distance between the location of the external reference point and the location of the dispensed fluid, determining a correction value based at least in part on the calculated distance, and using the correction value to improve placement accuracy of dispensed fluid.

Disclosed is droplet ejecting apparatus that ejects droplets of a functional liquid onto a workpiece to draw a pattern. The droplet ejecting apparatus includes: a workpiece table; a droplet ejecting head configured to eject the droplets onto the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction and a sub-scanning direction; and a control unit configured to: detect a position of the workpiece or a position of the workpiece table while relatively moving the workpiece table and the droplet ejecting head along a plurality of scanning lines extending in the main scanning direction and set side by side in the sub-scanning direction; and create, based on a detection result, a correction table that indicates a correlation between a position of the movement mechanism and a positional correction amount of the workpiece table.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.