A gateway device and system and method for use of the same are disclosed. In one embodiment, multiple wireless transceivers are located within an in-wall housing, which also interconnectedly includes a processor, memory, various physical ports and wireless transceivers. To improve convenience, the gateway device may establish a pairing with a proximate wireless-enabled interactive programmable device. Virtual remote control functionality for various amenities may then be provided. To improve safety, the gateway device may be incorporated into a geolocation and safety network.

Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.

Systems, methods, and computer-readable media are disclosed for a systems and methods for improved LIDAR return light capture efficiency. One example method may include comparing, by a controller including a processor and at a first time, a first temperature of a first computing element to a first threshold temperature and a second temperature of a second computing element to a second threshold temperature. The example method may also include sending, based on a determination that the first temperature is below the first threshold temperature and the second temperature is above the second threshold temperature, a first signal to a switch to activate a data output corresponding to the second computing element. The example method may also include sending, to the second computing element, a second signal to cause a third computing element to increase heat dissipation from the third computing element to the first computing element. The example method may also include receiving, from the first computing element, a third temperature of the first computing element at a second time. The example method may also include comparing the third temperature of the first computing element to the first threshold temperature. The example method may also include determining that the third temperature of the first computing element is at or above the first threshold temperature at the second time. The example method may also include sending, based on a determination that that the third temperature is at or above the first threshold temperature, a third signal to the switch to activate a data output corresponding to the first computing element.

With increased demand for compact computing and easy to install computer components, there is an increased demand for user-friendly cooling solutions. Therefore, there is provided a cooling unit (100) for cooling liquid in a liquid-cooled computer system (10), wherein the cooling unit (100) comprises: an airflow unit (110) for generating an airflow in a first direction (170) along an airflow path, a radiator unit (130) having a liquid inlet (126) for receiving an inflow of a cooling liquid, a liquid outlet (127) for releasing an outflow of cooling liquid, an inner liquid path (171) for conducting liquid between said liquid inlet (126) and said liquid outlet (127), an array of at least two radiator bridges (131, 132), each having a plurality of parallel channels (160), said radiator bridges (131, 132) traversing said airflow path and being spaced apart along said first direction (170), said radiator bridges (131, 132) further being thermally separated from one another by gaps (141), where a first radiator bridge (131) from among said array of at least two radiator bridges (131, 132) is arranged to receive liquid from said liquid inlet (126, 127) to pass through its channels (160), said first radiator bridge (131) being the radiator bridge that is the farthest from said airflow unit (110), where said inner liquid path (171) is conducted from said liquid inlet (126), sequentially via said radiator bridges (131, 132) by order of proximity to said first radiator bridge (131), and to said liquid outlet (127), whereby a flow of air generated by said airflow unit (110) passes through said radiator bridges (131, 132) to exchange heat between said flow of air and said radiator unit (130). Thereby, a cooling unit is provided that provides efficient cooling while fitting into hitherto inconvenient form factors.

An electronic apparatus includes a flow rate control circuit that controls a plurality of flow rate adjusting mechanisms, based on desired flow rates of the coolant for a plurality of electronic circuits and information that indicates relationships between pressure losses and flow rates in a plurality of routes that include internal flow passages of the plurality of electronic circuits, a plurality of distribution pipes, a plurality of discharge pipes, and the plurality of flow rate adjusting mechanisms and in which the coolant flows between the first pipe and the second pipe.

Systems and methods for cooling a vehicle computing system are provided. A computing system can include a cooling baseplate including a first planar cooling surface and a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

Systems, apparatuses, and methods for implementing an optimized adaptive thermal control mechanism for an integrated circuit (IC) are described. A control unit receives a digital input value which is representative of a temperature of an IC. The control unit compares the input value to at least two set points. A result of a first comparison determines whether an accumulator is incremented or decremented by a programmable gain value. A result of a second comparison determines whether the accumulator is primed with a preset ramp-up value. The preset ramp-up value is used since the accumulator can take several sensing cycles to reach the optimal control value while thermal gradients can become critical in only a few cycles. The output of the accumulator is provided to an actuator which adjusts parameter(s) to modulate the IC's temperature. The granularity and range of the accumulator matches the granularity and range of the actuator.

A thermal load system for testing a datacenter liquid cooling system is disclosed. The system includes a server box having at least one thermal feature associated with at least one cooling feature and at least one flow controller, where the at least one thermal feature and the at least one flow controller are adjustable to cause cooling stress on the datacenter liquid cooling system.

A computing system includes a target device to be cooled, a fan unit, a storage device storing a first portion and a second portion of firmware, and a baseboard management controller (BMC). In the firmware, only the first portion is related to heat-dissipation control. The BMC executes the firmware for monitoring the target device, generating a monitoring report for the target device, and controlling the rotational speed of the fan unit based on the monitoring report thus generated and on cooling parameters and cooling algorithms stored in the first portion of the firmware.

A communication module may be used in an information handling system comprising an air mover configured to drive a flow of air and a processing component communicatively coupled to the air mover for controlling operation of the air mover via a first wire configured to communicate air mover speed commands from the processing component to the air mover for controlling a speed of the air mover and a second wire configured to communicate tachometer information from the air mover to the processing component. The communication module may include a connector other than an air mover connector configured to couple the air mover to the first wire and the second wire and logic configured to monitor for an escape sequence communicated over the first wire from the processing component to enter a command mode and responsive to detecting the escape sequence, communicating information regarding the air mover to the processing component via the second wire.