LED operation rules correlating device event, LED action, LED color, and optionally LED brightness are specified in software. As devices connect to a host computer, a correlation between device ID and USB port is detected. A port map for the storage system is used to correlate the location of a USB port where the electronic device connected to a set of LEDs on the storage system. As the states of the electronic devices connected to the storage system change, the custom-defined LED operational rules are applied on the LEDs of the storage system to cause the LEDs identified by the LED operational rules to be illuminated. Since the LED operational rules are customizable, a user can cause any combination of LED action, color, and brightness to be associated with any electronic device state.

An information handling system may include a main chassis and a motherboard-less expansion chassis. The main chassis may include a host system motherboard and a first host interconnect card. The motherboard-less expansion chassis may include a second host interconnect card communicatively coupled to the first interconnect card via an external cable having one or more in-band signal channels and one or more sideband signal channels, a first information handling resource configured to communicate data with the host system motherboard via the one or more in-band signal channels, and a second information handling resource configured to communicate control signals with the host system motherboard via the one or more sideband signal channels.

Cooling of a computing device is described herein. The computing device includes a plurality of fans, a plurality of sensors, and a processor in communication with the plurality of fans and the plurality of sensors. Each sensor of the plurality of sensors is associated with at least one fan of the plurality of fans and is operable to determine a temperature. The processor is configured to determine, for each sensor of the plurality of sensors, a difference between the determined temperature and a predetermined temperature corresponding to the sensor. The processor is also configured to compared the determined differences. The processor is configured to increase a speed of at least a first fan of the plurality of fans based on the comparison, and determine which fan of the plurality of fans to decrease fan speed based on the increased speed of the first fan.

Provided are a master-slave system where a master apparatus remotely operates a slave apparatus and a control method of this system.

The master-slave system includes a slave apparatus that includes a temperature acquisition unit that acquires a temperature and a master apparatus that includes a presentation unit that presents the acquired temperature. The presentation unit includes a temperature change unit that is provided on the operation unit and produces a temperature change on the basis of the acquired temperature to produce a temperature change in harmony with the acquired temperature. Moreover, the master-slave system further includes a determination unit that determines a type or a characteristic of the operation target on the basis of an input temperature input by the temperature input unit and the temperature acquired by the temperature acquisition unit.

A component control system includes a component. At least one component element is included in the component. A component controller is included in the component, coupled to the at least one component element, and operable to couple to an Information Handling System (IHS) controller. The component controller is operable to receive a normalized component performance (NCP) value from the IHS controller. The NCP value is associated with at least one component output range. The component controller is also operable to provide a control signal that is associated with the NCP value to the at least one component element. In response to receiving the control signal, the at least one component element operates such that the component produces at least one component output, and each component output produced by the component is within a corresponding component output range.

The disclosure provides a cooling solution that evaluates the thermal environment of a computer component based on transient thermal responses of the computer component. The transient thermal responses are generated by measuring the temperature rise of the computer component over a designated amount of time for multiple good assemblies and multiple bad assemblies to determine a duration and allowable temperature rise needed to set a pass/fail criteria for different failure modes of cooling devices. A cooling device may not be operating as designed due to damage, needed maintenance, missing thermal interface material (TIM), improper installation, etc. From the transient thermal responses, a thermal problem, such as a malfunctioning fan, can be determined and a corrective action can be performed.

With increased demand for compact computing and easy to install computer components, there is an increased demand for user-friendly cooling solutions. Therefore, there is provided a cooling unit (100) for cooling liquid in a liquid-cooled computer system (10), wherein the cooling unit (100) comprises: an airflow unit (110) for generating an airflow in a first direction (170) along an airflow path, a radiator unit (130) having a liquid inlet (126) for receiving an inflow of a cooling liquid, a liquid outlet (127) for releasing an outflow of cooling liquid, an inner liquid path (171) for conducting liquid between said liquid inlet (126) and said liquid outlet (127), an array of at least two radiator bridges (131, 132), each having a plurality of parallel channels (160), said radiator bridges (131, 132) traversing said airflow path and being spaced apart along said first direction (170), said radiator bridges (131, 132) further being thermally separated from one another by gaps (141), where a first radiator bridge (131) from among said array of at least two radiator bridges (131, 132) is arranged to receive liquid from said liquid inlet (126, 127) to pass through its channels (160), said first radiator bridge (131) being the radiator bridge that is the farthest from said airflow unit (110), where said inner liquid path (171) is conducted from said liquid inlet (126), sequentially via said radiator bridges (131, 132) by order of proximity to said first radiator bridge (131), and to said liquid outlet (127), whereby a flow of air generated by said airflow unit (110) passes through said radiator bridges (131, 132) to exchange heat between said flow of air and said radiator unit (130). Thereby, a cooling unit is provided that provides efficient cooling while fitting into hitherto inconvenient form factors.

A data center comprises an enclosed space, a support disposed in the enclosed space, a plurality of cryptocurrency miners disposed on the support, and a barrier wall separating the enclosed space into a first portion on a relatively cool side and a second portion on a relatively warm side. The cryptocurrency miners each comprise a miner fan for circulating air from the first portion, and the cryptocurrency miners are each disposed so that air moved by the miner fan is exhausted into the second portion. A method of cooling a data center involves drawing relatively cool air into and through miners. Once the air is warmed inside the miners, the air is exhausted into a partitioned space.

In one or more embodiments, an information handling system may include an information indication assembly. For example, the information indication assembly may include at least one light emitter; multiple conductors coupled to the at least one light emitter; a pin that includes a rigid material and that permits the first plurality of conductors to pass through; and a grommet that includes an elastic material and configured to house the pin. In one instance, the pin and the grommet may be aligned along a longitudinal axis of the information indication assembly. In a second instance the pin and the grommet form a fastener of a fan associated with the information handling system. In another instance, the elastic material may mitigate vibrations from the fan. In one or more embodiments, a printed circuit board may include the multiple conductors. For example, the printed circuit board may be a flexible printed circuit board.

A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.