An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

A display apparatus includes a flexible circuit board including a plurality of first substrate pads and a plurality of second substrate pads, a main circuit board connected to the flexible circuit board, and a display panel including a plurality of first display pads and a plurality of second display pads, where the plurality of first display pads is connected to the main circuit board through the flexible circuit board and each of the plurality of first display pads at least partially overlaps corresponding substrate pad of the plurality of first substrate pads, respectively, and each of the plurality of second display pads at least partially overlaps corresponding substrate pad of the plurality of second substrate pads, respectively.

An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

A display panel includes an array substrate, a first flexible circuit board, a non-flexible circuit board, a control circuit board and a second flexible circuit board; the first flexible circuit board is electrically connected to the array substrate; the non-flexible circuit board is electrically connected to the first flexible circuit board; the control circuit board is provided on the non-flexible circuit board and is electrically connected with the non-flexible circuit board; the second flexible circuit board is electrically connected to the non-flexible circuit board.

The present invention discloses a display panel, a chip and a flexible circuit board. The display panel includes a panel body and at least two signal transmission circuits. The signal transmission circuit includes a line input terminal used for binding to a flexible circuit board, which is disposed at the peripheral area, a signal transmission line, and a line output terminal used for binding to a chip, which is disposed at the peripheral area. At least two of the line output terminals are arranged in a two-dimensional array. The present invention can reduce the impedance of a part of the signal transmission line.

Examples of a holding device for retaining an installable component in a chassis of a computing device are described. In one example, the holding device may comprise a longitudinally extending first arm, and a movably coupled second arm. The holding device may further comprise a first engaging portion at first end of the holding device, and a second engaging portion at the second end of the holding device. The engaging portions may couple the holding device to the chassis of the computing device. Furthermore, the holding device may comprise a gripping member. The gripping member is to securely retain the installable component within the chassis of the computing device, and is movable across the length of the holding device.

A rod structure is used in an electronic device, the rod structure includes an engaging rod and a fastener. The engaging rod includes a rod. The rod includes an assembly portion and a push portion. The assembly portion is movably assembled at an assembled object, and the push portion is for pushing a pushed object. The fastener is for engaging the engaging rod at an engaged object. When the fastener is engaged with or disengaged from the engaged object, the engaging rod is for causing the push portion to push against the pushed object.

A drive carrier for a device of an information handling system includes first and second portions. The first and second portions are placed in physical communication with the device. The first portion includes first and second side rails to secure the device within the drive carrier. The first and second side rails slide within a first slot of a bay of the information handling system. The second portion is located on top of the first portion and floats away from and toward the first portion when the drive carrier is inserted with the bay of the information handling system. An amount of float for the second portion is based on a bay pitch of the bay.

A buckle base and buckle-fixing pin combination to be used in fixing a printed circuit board to a sheet includes a buckle base and a buckle-fixing pin. The buckle base is in a generally U-shaped form. The buckle base includes a first leg, a second leg, and a bridge therebetween. The first and second legs are connected to the bridge. The buckle-fixing pin forms a longitudinal slot therein.