Spacer self-aligned via structures for gate contact or trench contact are described. In an example, an integrated circuit structure includes a plurality of gate structures above a substrate. A plurality of conductive trench contact structures is alternating with the plurality of gate structures. The integrated circuit structure also includes a plurality of dielectric spacers, a corresponding one of the plurality of dielectric spacers between adjacent ones of the plurality of gate structures and the plurality of conductive trench contact structures, wherein the plurality of dielectric spacers protrudes above the plurality of gate structures and above the plurality of conductive trench contact structures. A conductive structure is in direct contact with one of the plurality of gate structures or with one of the plurality of conductive trench contact structures.

An electronic device and method of manufacturing are disclosed. The electronic device includes a first metal segment including a first engagement portion, a second metal segment including a second engagement portion, the second metal segment spaced apart from the first metal segment so as to define a slit with the first metal segment, a support insulator engaging the first and second engagement portions, the support insulator supporting the first and second metal segments, and providing insulation between the first and second metal segments, and a filler enclosing at least a portion of the support insulator, and filling at least a portion of the slit. In the method, the first and second metal segments are arranged to define a slit therebetween, a support insulator is engaged to the isolated first and second metal segments, and the slit is filled with a material enclosing at least part of the support insulator.

A device having fool-proofing structure is configured to be inserted into a cabinet along a first direction and includes a case and an elastic sheet module. The elastic sheet module is disposed on a side of the case and includes a first end disposed on the case, a second end opposite to the first end, a first protrusion portion and a second protrusion portion. The first protrusion portion is adjacent to the second end, protrudes from the case and is configured to abut against the cabinet. The second protrusion portion is farther from the second end than the first protrusion portion, protrudes from the case, and is configured to make the second end and the first protrusion portion move toward the interior of the case as being pressed by a force.

A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 μm or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in.sup.3.

A cooling assembly for a computer module has a cooling device and a mounting device. The mounting device includes a rod shaped fastening element having a male thread and a stop. The fastening element is nonrotatable and movable along its axis with respect to the cooling device. The fastening element is guided through a first hole in the cooling device and a second hole in the computer module, when the cooling device is mounted on the computer module. The stop prevents the fastening element from sliding through the first and second holes. The mounting device also has an elastic element arranged along the axis of the fastening element that presses or pulls the stop away from the computer module. A nut on the mounting device is engageable with the male thread of the fastening element. The stop and the nut are arranged at opposite sides of the computer module.

An electronic component comprises a heat source component provided on a substrate; a case component covering the heat source component; a heat receiving component facing the case component; and a wall portion protruding from the heat receiving component, the wall portion configured to transfer heat indirectly transferred from the heat source component to the heat receiving component, wherein a heat release path of heat indirectly transferred from the heat source component to the wall portion includes a path away from the heat receiving component, the path extending in a wall portion direction toward the wall portion in a direction along a front surface of the heat receiving component.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.

An electronic device with storage functionality is provided. The electronic device includes a first housing member, a first circuit board, a second housing member and a second circuit board. The first circuit board is connected to the first housing member. The second circuit board is coupled to the first circuit board and is parallel to the first circuit board. The first housing member includes two hooks, and the hooks are wedged against the first edge of the second circuit board.

A display device includes a display panel including a folding region at which the display panel is foldable, and in order from the display panel a first plate facing the display panel and including a lower surface furthest from the display panel, a heat dissipation layer facing the first plate, and a second plate facing the heat dissipation layer, the second plate defining a first opening which exposes the lower surface of the first plate to outside the second plate.

A tray is detachably assembled to a chassis. The chassis includes a first chassis guide post. The tray includes a tray body, a handle and a first sliding piece. The tray body includes a side wall and a through slot disposed on the side wall. The handle is pivotally connected to the side wall and includes a handle guide post. The first sliding piece includes a first groove and a second groove. The handle guide post is disposed in the through slot and the first groove. The first chassis guide post is detachably disposed in the second groove.