According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.

According to an implementation, a computing device includes electronic circuitry, and an antenna and heat venting chamber having an antenna radiating element disposed in at least a first plane, a ground plane element disposed in at least a second plane, a first side wall member defining a plurality of perforations, and a second side wall member having a portion that is disposed opposite to the first side wall member, where the portion of the second side wall member defines at least one opening. The computing device includes a cooling system configured to vent heat generated by the electronic circuitry through the antenna and heat venting chamber.

A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.

A video processing apparatus includes a housing defining an interior space, the housing having first, second, third, and fourth sides and a back side extending between the first, second, third and fourth sides, the back side including a back wall having a main portion laying on a back plane, a recessed portion recessed from the back plane and defining a video connection recess, and a recessed wall extending from the main portion to the recessed portion, the recessed wall having a video connector opening, and the recessed portion having an angled surface lying at an angle of at least 5 degrees relative to the back plane; and a video output socket in the interior space and aligned with the video connector opening of the recessed wall, whereby the angled surface facilitates insertion of a video connector into the video output socket.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A heat sink assembly includes a casing having an opening, a main board accommodated in the casing, a heat sink mounted on the main board, an electrical connector mounted on the main board and exposed in the opening, a mating connector located outside the casing and connected to the electrical connector through the opening in a plugging manner, and a heat conductor, disposed inside the casing. The mating connector has a chip that is electrically connected to the electrical connector. One end of the heat conductor is connected to the heat sink, and the other end of the heat conductor is thermally connected to the electrical connector or the mating connector, so that heat generated by the chip during working can be transferred to the heat sink through the heat conductor, thereby reducing a temperature of the mating connector.

A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.