According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

An energy offloading system is in direct electric communication with an energy supply and dynamically receives energy from the energy supply. The energy offloading system uses energy for high-load computations. The energy offloading system includes computers performing the high-load computations as well as servers, cooling units, and communication devices. When the energy from the energy supply is terminated, the energy offloading system may power down these and other devices, or may switch these devices to an alternative power source. The energy offloading system may be portable.

Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.

A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.

An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.

A display device includes a display panel including a base layer, a first heat dissipation member disposed on a first surface of the base layer, and a second heat dissipation member disposed on a first surface of the first heat dissipation member. The first heat dissipation member includes a first polymer resin and first metal nano-particles dispersed in the first polymer resin, and the second heat dissipation member includes a second polymer resin and second metal nano-particles dispersed in the second polymer resin. The weight of the first metal nano-particles in the first heat dissipation member may be different from the weight of the second metal nano-particles in the second heat dissipation member.

An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.

An information handling system with an antenna cooling system, comprising a processor; a memory; a power management unit (PMU) operatively coupled to the processor; a wireless interface adapter with a radio module within a chassis of the information handling system; and an active antenna system with an antenna mounted at an aperture in a wall of the chassis of the information handling system; a thermally conductive and radio frequency (RF) transparent window formed seamlessly within the aperture in the wall of the chassis of the information handling system and where the thermally conductive and RF transparent window is configured to permit antenna RF transmission while dissipating heat generated by the active antenna system.

An EMI attenuation device includes a housing stator, a fan rotor, and an electrical bridge therebetween. The housing stator has an aperture therethrough, and at least a portion of the housing stator is electrically conductive. The fan rotor is adjacent to the aperture and has a rotational axis relative to the housing stator and a proximate surface proximate the housing stator. The fan rotor is electrically conductive, and the proximate surface is continuous around a rotational direction of the fan rotor. The electrical bridge is between the proximate surface of the fan rotor and a contact surface of the housing stator.

A wearable display device is disclosed and includes a main body and a driving module. The main body includes a frame, two temple arms and at least one monitor. The two temple arms are respectively connected with two ends of the frame, and the monitor is disposed on the frame. The driving module is disposed within the frame and includes a microprocessor, an optical display module and a heat dissipation component. The optical display module is electrically coupled with the microprocessor and configured for displaying an optical image on the at least one monitor. The heat dissipation component includes a heat dissipation base and two heat pipes. The two heat pipes are disposed on the heat dissipation base adjacent to the microprocessor. When the heat generated by the microprocessor is conducted to the heat dissipation base, the two heat pipes perform heat exchange with the heat dissipation base.