A semiconductor device includes a switching element, a control circuit, and a first and second temperature detectors. The control circuit controls the switching element and have an overcurrent detection circuit for the switching element. The first temperature detector detects the temperature of the switching element and the second temperature detector detects the temperature of the control circuit. The control circuit includes a reference correction circuit for correcting an overcurrent reference value of the overcurrent detection circuit on the basis of a first detection value and a second detection value detected by the first and second temperature detectors and outputting a corrected overcurrent reference value.

Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Power consumption of a cooling fan of an information processing device is reduced. A processor reduces a speed of the cooling fan provided in the information processing device, and controls the cooling fan at a first speed when there is no problem with the operation of the information processing device, the first speed being obtained by reducing the speed of the cooling fan. An interface transmits first information indicating the first speed to a management device. The processor receives second information indicating a second speed from the management device that associates the first speed with identification information identifying the information processing device and stores therein the first information indicating the first speed and the identification information, and controls the speed of the cooling fan according to the second speed when the second speed is lower than the first speed.

A computer system including a PCH (platform controller hub), a CPLD (complex programmable logic device), a first switch and a processor, and a control method are provided to control the operation frequency of the processor. The CPLD is coupled to the PCH and the first switch. The processor is coupled to the first switch. The PCH produces and outputs a second control signal according to the first firmware and a first control signal from a command input unit. The CPLD produces and outputs a third control signal according to the second firmware and the second control signal. The first switch receives the third control signal and is turned on to output a triggering signal when the third control signal is valid. The processor includes a PROCHOT pin. The processor receives the triggering signal and triggers the PROCHOT pin for frequency control.

A system and method for active disturbance rejection based thermal control is configured to receive, at a first active disturbance rejection thermal control (ADRC) controller, a first temperature measurement from a first thermal zone. The ADRC controller generates a first output control signal for controlling a first cooling element, wherein the first output control signal is generated according a first estimated temperature and a first estimated disturbance calculated by a first extended state observer (ESO) of the first ADRC controller.

Methods and apparatus to execute a workload in an edge environment are disclosed. An example apparatus includes a node scheduler to accept a task from a workload scheduler, the task including a description of a workload and tokens, a workload executor to execute the workload, the node scheduler to access a result of execution of the workload and provide the result to the workload scheduler, and a controller to access the tokens and distribute at least one of the tokens to at least one provider, the provider to provide a resource to the apparatus to execute the workload.

A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

Custom cooling strategies may be implemented for different regions in computers, servers, and other information handling systems. Chassis architecture may have multiple cooling fans, with each fan cooling a different region via dedicated duct work. A user or administrator may thus implement different cooling strategies for internal components, based on different thermal curves defined for each different region.

A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.