Techniques are described for managing temperature in an autonomous vehicle. An exemplary method comprises performing autonomous driving operations that operate the autonomous vehicle in an autonomous mode, receiving one or more messages from a temperature sensor associated with an electrical device located on or in the autonomous vehicle while the autonomous vehicle is operated in the autonomous mode, determining a cooling technique to reduce the temperature of electrical device, and performing the cooling technique.

The systems and methods manage thermal states of a device through user configuration of a client application on the device. The systems and methods set thermal thresholds associated with the device. The systems and methods infer the thermal thresholds from information gathered by a client application running on the device. The systems and methods implement a stored policy associated with a violation of one of the thermal thresholds by one of the monitored thermal states.

A thermal management system for an enclosure containing electrical components includes a cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can receive a three-phase power input signal and distribute power and control connected components using the three-phase signal. The controller can protect the compressor in critical scenarios such as thermal overload and overcurrent. The controller can output various faults such as missing phase alarm, imbalance phase alarm, overcurrent alarm, thermal overload alarm, door open alarm, and temperature and pressure alarms. An auto phase sequence correction controls the phase relay, accepting 3 phase 480 VAC power input from facility power terminal, supplying 3 phase power to the compressor and motor impellers, 12V DC power to a display unit, and 24V DC power to a remote access control module.

Disclosed is an electronic device which includes a main processor, and a systolic array processor, and the systolic array processor includes processing elements, a kernel data memory that provides a kernel data set to the processing elements, a data memory that provides an input data set to the processing elements, and a controller that provides commands to the processing elements. The main processor translates source codes associated with the systolic array processor into commands of the systolic array processor, calculates a switching activity value based on the commands, and stores the translated commands and the switching activity value to a machine learning module, which is based on the systolic array processor.

A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.

A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

Embodiments are generally directed to enhanced power management for support of priority system events. An embodiment of a system includes a processing element; a memory including a registry for information regarding one or more system events that are designated as priority events; a mechanism to track operation of events that requires Turbo mode operation for execution; and a power control unit to implement a power management algorithm. The system is to maintain an first energy budget and a second residual energy budget for operation in a Turbo power mode, and wherein the power management algorithm is to determine whether to authorize execution of a detected system event in the Turbo power mode based on the second residual energy budget upon determining that the first energy budget is not sufficient for execution of the detected system event and that the detected system event is designated as a priority event. Priority designations for the priority events may include a first High Priority designation and a second Critical designation.

Systems and methods for allocating memory and redirecting data writes based on temperature of memory modules in a cloud computing system are described. A method includes maintaining temperature profiles for a first plurality of memory modules and a second plurality of memory modules, The method includes automatically redirecting a first request to write to memory from a first compute entity being executed by the first processor to a selected one of a first plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the first plurality of memory modules and automatically redirecting a second request to write to memory from a second compute entity being executed by the second processor to a selected one of the second plurality of memory chips, whose temperature does not meet or exceed the temperature threshold, included in at least the second plurality of memory modules.

A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

An information handling system executing an integrated antenna power and cooling management system may comprise an antenna situated nearby components of the information handling system, a chassis enclosing the information handling system, the antenna, and a wireless interface device with a wireless radio to generate a signal to transmit data via the antenna, where the components and the chassis are capable of absorbing a total thermal heat capacity, the chassis having an outer surface coming into contact with human skin during execution of the information handling system, a temperature sensor to determine an operating temperature of the information handling system reaching a control point value, and a processor executing code instructions to estimate antenna thermal output during data transmission relative to the total thermal heat capacity of the components, based on the operating temperature of the information handling system, and control an active cooling system for cooling the chassis.