A semiconductor device comprising a processor having a pipelined architecture and a pipeline flattener and a method for operating a pipeline flattener in a semiconductor device are provided. The processor comprises a pipeline having a plurality of pipeline stages and a plurality of pipeline registers that are coupled between the pipeline stages. The pipeline flattener comprises a plurality of trigger registers for storing a trigger, wherein the trigger registers are coupled between the pipeline stages.

This disclosure describes a reduced pin bus that can be used on integrated circuits or embedded cores within integrated circuits. The bus may be used for serial access to circuits where the availability of pins on ICs or terminals on cores is limited. The bus may be used for a variety of serial communication operations such as, but not limited to, serial communication related test, emulation, debug, and/or trace operations of an IC or core design. Other aspects of the disclosure include the use of reduced pin buses for emulation, debug, and trace operations and for functional operations.

This disclosure describes a reduced pin bus that can be used on integrated circuits or embedded cores within integrated circuits. The bus may be used for serial access to circuits where the availability of pins on ICs or terminals on cores is limited. The bus may be used for a variety of serial communication operations such as, but not limited to, serial communication related test, emulation, debug, and/or trace operations of an IC or core design. Other aspects of the disclosure include the use of reduced pin buses for emulation, debug, and trace operations and for functional operations.

A parallel processing system includes at least three parallel processors, state monitoring circuitry, and state reload circuitry. The state monitoring circuitry couples to the at least three parallel processors and is configured to monitor runtime states of the at least three parallel processors and identify a first processor of the at least three parallel processors having at least one runtime state error. The state reload circuitry couples to the at least three parallel processors and is configured to select a second processor of the at least three parallel processors for state reload, access a runtime state of the second processor, and load the runtime state of the second processor into the first processor. Monitoring and reload may be performed only on sub-systems of the at least three parallel processors. During reload, clocks and supply voltages of the processors may be altered. The state reload may relate to sub-systems.

A parallel processing system includes at least three parallel processors, state monitoring circuitry, and state reload circuitry. The state monitoring circuitry couples to the at least three parallel processors and is configured to monitor runtime states of the at least three parallel processors and identify a first processor of the at least three parallel processors having at least one runtime state error. The state reload circuitry couples to the at least three parallel processors and is configured to select a second processor of the at least three parallel processors for state reload, access a runtime state of the second processor, and load the runtime state of the second processor into the first processor. Monitoring and reload may be performed only on sub-systems of the at least three parallel processors. During reload, clocks and supply voltages of the processors may be altered. The state reload may relate to sub-systems.

In various examples, one or more components or regions of a processing unit—such as a processing core, and/or component thereof—may be tested for faults during deployment in the field. To perform testing while in deployment, the state of a component subject to test may be retrieved and/or stored during the test to maintain state integrity, the component may be clamped to communicatively isolate the component from other components of the processing unit, a test vector may be applied to the component, and the output of the component may be compared against an expected output to determine if any faults are present. The state of the component may be restored after testing, and the clamp removed, thereby returning the component to its operating state without a perceivable detriment to operation of the processing unit in deployment.

In various examples, one or more components or regions of a processing unit—such as a processing core, and/or component thereof—may be tested for faults during deployment in the field. To perform testing while in deployment, the state of a component subject to test may be retrieved and/or stored during the test to maintain state integrity, the component may be clamped to communicatively isolate the component from other components of the processing unit, a test vector may be applied to the component, and the output of the component may be compared against an expected output to determine if any faults are present. The state of the component may be restored after testing, and the clamp removed, thereby returning the component to its operating state without a perceivable detriment to operation of the processing unit in deployment.

A method for repairing a processor. The processor comprises a plurality of processing units and an exchange comprising a plurality of exchange paths for transmitting data between the processing units. Each processing unit is connected to output data to a respective exchange path. An exchange path functional test of at least a portion of the exchange paths is carried out. Based on the exchange path functional test, it is identified that one or more of the exchange paths is defective, and the processing units connected to the one or more defective exchange paths is identified. The identified processing units are switched out of functional operation of the processor and switching in at least one repair processing unit connected to a non-defective exchange path for functional operation of the processor.

A processor comprises an exchange, a plurality of columns, and a plurality of exchange scan chains. The exchange comprises a plurality of exchange paths, each comprising a set of exchange path portions, for transmitting data between processing units. Each of the plurality of column comprises processing units, each processing unit connected to output data to a respective exchange path, and column pipe circuitry for providing a controllable path between the exchange and the processing units. The column pipe circuitry comprises a column wrapper chain for preventing a scan test signal from passing between the exchange paths and the processing units. The exchange scan chains enable scan testing of the exchange paths. Each exchange scan chain comprises a plurality of scan chain segments, each scan chain segment comprises an exchange path portion connected to at least one of the processing units of at least one of the columns of the processor.

A computer-implemented method is provided for redundancy reduction for driving test scenarios. The method includes receiving an original test set of driving scenarios and a driving model which simulates a vehicle behavior under a driving scenario inputted to the driving model. The method includes, for each driving scenario of the original test set, obtaining vehicle dynamics timeseries data as an output of the driving model. The method includes determining similar driving scenarios by comparing driving model outputs. The method additionally includes creating a new test set of driving scenarios by discarding duplicated ones of the similar driving scenarios from the original test set.