G06F11/27

LOGIC BUILT-IN SELF-TEST OF AN ELECTRONIC CIRCUIT

A tool for performing a logic built-in self-test of an electronic circuit operating on a clock cycle basis. The tool stores a configurable test signature in a random-access memory together with a pattern counter for a test pattern, wherein a number of the at least one additional signature register corresponds to a number of entries in the random access memory. The tool determines an error based, at least in part, on a compare operation for a given test pattern, wherein the compare operation determines whether the test signature in the first signature register before a capture cycle of a next test pattern differs from the corresponding configurable test signature. The tool stores the error in a corresponding additional signature register.

Linking embedded controller with memory reference code and system bios shadowing

An information handling system may include at least one processor, a memory, and an embedded controller (EC). The information handling system may be configured to, prior to initialization of an operating system of the information handling system: execute memory reference code configured to test selected regions of the memory; transmit results of the memory reference code to the EC; store, at the EC, information indicative of respective likelihoods that particular regions of the memory are bad; and upon a subsequent boot, select a region of the memory having a low likelihood of being bad for loading a Basic Input/Output System (BIOS) of the information handling system.

Linking embedded controller with memory reference code and system bios shadowing

An information handling system may include at least one processor, a memory, and an embedded controller (EC). The information handling system may be configured to, prior to initialization of an operating system of the information handling system: execute memory reference code configured to test selected regions of the memory; transmit results of the memory reference code to the EC; store, at the EC, information indicative of respective likelihoods that particular regions of the memory are bad; and upon a subsequent boot, select a region of the memory having a low likelihood of being bad for loading a Basic Input/Output System (BIOS) of the information handling system.

Fault injection in a clock monitor unit
11609833 · 2023-03-21 · ·

A self-test mechanism within an integrated circuit to test for faulty operation of a clock monitor unit implemented within the integrated circuit for monitoring a clock signal. The mechanism intentionally injects faults into the clock monitor unit to evaluate if the clock monitor unit is operating in accordance with its specified operating parameters. The injected faults are intended to cause the clock monitor unit to determine that the clock signal is operating outside of an artificially generated, imaginary specified frequency range. If the injected faults do not cause the clock monitor unit to determine that the clock signal is operating both above and below the artificially generated, imaginary specified frequency range, then the clock monitor unit is not functioning according to specified operating parameters.

Fault injection in a clock monitor unit
11609833 · 2023-03-21 · ·

A self-test mechanism within an integrated circuit to test for faulty operation of a clock monitor unit implemented within the integrated circuit for monitoring a clock signal. The mechanism intentionally injects faults into the clock monitor unit to evaluate if the clock monitor unit is operating in accordance with its specified operating parameters. The injected faults are intended to cause the clock monitor unit to determine that the clock signal is operating outside of an artificially generated, imaginary specified frequency range. If the injected faults do not cause the clock monitor unit to determine that the clock signal is operating both above and below the artificially generated, imaginary specified frequency range, then the clock monitor unit is not functioning according to specified operating parameters.

BUILT IN SELF TEST (BIST) FOR CLOCK GENERATION CIRCUITRY
20230079000 · 2023-03-16 ·

Testing clock division circuitry includes generating pseudo random test pattern bits for scan chain logic in programmable clock division logic circuitry and divided clock counter circuitry. A shift clock is used to shift the test pattern bits into the scan chain logic. A capture clock signal is used in the programmable clock division logic during a non-test mode of operation. The shift clock is used to provide output shift bits from the scan chain logic to a multi-input shift register (MISR). Once all the output shift bits for the test pattern bits are provided to the MISR, a final test signature from the MISR is compared to an expected test signature to determine whether the programmable clock division logic circuitry and divided clock counter circuitry are free of faults.

TEST CONTROL DEVICE, TEST SYSTEM, AND CONTROL METHOD
20230080117 · 2023-03-16 ·

A test control device includes a test variable generation device and a test processing device. The test variable generation device uses a test prediction model to generate a first manipulated variable based on a difference between a target value and a first controlled variable value from a device under test. The test processing device acquires a second controlled variable value from the device under based on use of the first manipulated variable value. The test variable generation device notifies the device under test of end of a test if the second controlled variable value is equal to or greater than the target value or uses the test prediction model to generate a second manipulated variable based on a difference between the target value and the second controlled variable value when the second controlled variable value is less than the target value.

TEST CONTROL DEVICE, TEST SYSTEM, AND CONTROL METHOD
20230080117 · 2023-03-16 ·

A test control device includes a test variable generation device and a test processing device. The test variable generation device uses a test prediction model to generate a first manipulated variable based on a difference between a target value and a first controlled variable value from a device under test. The test processing device acquires a second controlled variable value from the device under based on use of the first manipulated variable value. The test variable generation device notifies the device under test of end of a test if the second controlled variable value is equal to or greater than the target value or uses the test prediction model to generate a second manipulated variable based on a difference between the target value and the second controlled variable value when the second controlled variable value is less than the target value.

TELEMETRY-BASED MODEL DRIVEN MANUFACTURING TEST METHODOLOGY

An approach is presented herein to use an in-situ algorithmic decision methodology during each stage of testing before 2C/4C to decide how long to test, how much margin should be used for each device under the test (DUT) to shorten or eliminate 2C/4C testing. Each DUT will be tested differently based on the risk level or the likelihood of failure at 2C/4C. To be able to achieve this, low-level hardware (HW) based sensors (on the printed circuit board assembly (PCBA), in power module, in silicon components, in silicon component complex, etc.) are used to collect telemetry data with a high frequency data acquisition rate during the testing. As testing is ongoing for each DUT, a margin distribution and algorithm modeling is performed in-situ.

TELEMETRY-BASED MODEL DRIVEN MANUFACTURING TEST METHODOLOGY

An approach is presented herein to use an in-situ algorithmic decision methodology during each stage of testing before 2C/4C to decide how long to test, how much margin should be used for each device under the test (DUT) to shorten or eliminate 2C/4C testing. Each DUT will be tested differently based on the risk level or the likelihood of failure at 2C/4C. To be able to achieve this, low-level hardware (HW) based sensors (on the printed circuit board assembly (PCBA), in power module, in silicon components, in silicon component complex, etc.) are used to collect telemetry data with a high frequency data acquisition rate during the testing. As testing is ongoing for each DUT, a margin distribution and algorithm modeling is performed in-situ.