The technology relates to a system on chip (SoC). The SoC may include a network on layer including one or more routers and an application specific integrated circuit (ASIC) layer bonded to the network layer, the ASIC layer including one or more components. In some instances, the network layer and the ASIC layer each include an active surface and a second surface opposite the active surface. The active surface of the ASIC layer and the second surface of the network may each include one or more contacts, and the network layer may be bonded to the ASIC layer via bonds formed between the one or more contacts on the second surface of the network layer and the one or more contacts on the active surface of the ASIC layer.

An acceleration system includes a plurality of modules. Each of the plurality of modules includes at least one central processing unit, at least one graphics processing unit, at least one field programmable gate array, or at least one application specific integrated circuit. At least one of the plurality of modules includes at least another of the plurality of modules such that the acceleration system is structural and nested.

A logic power network provided in an application-specific integrated circuit (ASIC). The ASIC includes a central processor. The ASIC also includes at least one intellectual property (IP) core operatively connected with the central processor and having a set of electrical components provided therein. The ASIC also includes a network-on-chip (NOC) operatively connected with the central processor and the at least one IP core. The ASIC also includes a logic power network operatively connected with the central processor, the at least one IP core and the set of electrical components therein, and the NOC. The logic power network is adapted to control power of the at least one IP core and the set of electrical components provided in the at least one IP Core individually and separately.

The technology relates to a system on chip (SoC). The SoC may include a plurality of network layers which may assist electrical communications either horizontally or vertically among components from different device layers. In one embodiment, a system on chip (SoC) includes a plurality of network layers, each network layer including one or more routers, and more than one device layers, each of the plurality of network layers respectively bonded to one of the device layers. In another embodiment, a method for forming a system on chip (SoC) includes forming a plurality of network layers in an interconnect, wherein each network layer is bonded to an active surface of a respective device layer in a plurality of device layer.

A method of processing partitions of a tensor in a target order includes receiving, by a reorder unit and from two or more producer units, a plurality of partitions of a tensor in a first order that is different from the target order, storing the plurality of partitions in the reorder unit, and providing, from the reorder unit, the plurality of partitions in the target order to one or more consumer units. In an example, the one or more consumer units process the plurality of partitions in the target order.

On-circuit data activity monitoring may be performed for a systolic array. A current data activity measurement may be determined for changes in input data for processing at a systolic array and compared with a prior data activity measurement. Based on the comparison, a throttling recommendation may be provided to a management component to determine whether to perform the throttling recommendation.

The technology relates to a system on chip (SoC). The SoC may include a plurality of network layers which may assist electrical communications either horizontally or vertically among components from different device layers. In one embodiment, a system on chip (SoC) includes a plurality of network layers, each network layer including one or more routers, and more than one device layers, each of the plurality of network layers respectively bonded to one of the device layers. In another embodiment, a method for forming a system on chip (SoC) includes forming a plurality of network layers in an interconnect, wherein each network layer is bonded to an active surface of a respective device layer in a plurality of device layer.

The technology relates to a system on chip (SoC). The SoC may include a plurality of network layers which may assist electrical communications either horizontally or vertically among components from different device layers. In one embodiment, a system on chip (SoC) includes a plurality of network layers, each network layer including one or more routers, and more than one device layers, each of the plurality of network layers respectively bonded to one of the device layers. In another embodiment, a method for forming a system on chip (SoC) includes forming a plurality of network layers in an interconnect, wherein each network layer is bonded to an active surface of a respective device layer in a plurality of device layer.

An application specific integrated circuit (ASIC) chip includes: a systolic array of cells; and multiple controllable bus lines configured to convey data among the systolic array of cells, in which the systolic array of cells is arranged in multiple tiles, each tile of the multiple tiles including 1) a corresponding subarray of cells of the systolic array of cells, 2) a corresponding subset of controllable bus lines of the multiple controllable bus lines, and 3) memory coupled to the subarray of cells.

A reconfigurable computing appliance includes a number of computing tiles. Each computing tile includes a reconfigurable processing element and a network fabric interface device configured to communicate over a network fabric. The reconfigurable processing element operates on data received from an I/O input interface and/or data received via the network fabric interface device.