A method comprising categorizing nodes of a fabricated circuit as being priority nodes and nodes as being inferior nodes; evaluating a first priority node by automatically designating for verification the first priority node, and ascertaining whether a measured signal from the first priority node meets a pass-fail criterion for the first priority node; evaluating, when the measured signal from the first priority node meets the pass-fail criterion, a second priority node by automatically designating for verification the second priority node, and ascertaining whether a measured signal from the second priority node meets a pass-fail criterion for the second priority node; and evaluating, when the measured signal from the first priority node does not meet the pass-fail criterion, a first inferior node, by automatically designating for verification the first inferior node, and ascertaining whether a measured signal from the first inferior node meets a pass-fail criterion for the first inferior node.

A method comprising categorizing nodes of a fabricated circuit as being priority nodes and nodes as being inferior nodes; evaluating a first priority node by automatically designating for verification the first priority node, and ascertaining whether a measured signal from the first priority node meets a pass-fail criterion for the first priority node; evaluating, when the measured signal from the first priority node meets the pass-fail criterion, a second priority node by automatically designating for verification the second priority node, and ascertaining whether a measured signal from the second priority node meets a pass-fail criterion for the second priority node; and evaluating, when the measured signal from the first priority node does not meet the pass-fail criterion, a first inferior node, by automatically designating for verification the first inferior node, and ascertaining whether a measured signal from the first inferior node meets a pass-fail criterion for the first inferior node.

A method and system for migrating an existing ASIC design from one semiconductor fabrication process to another are disclosed herein. In some embodiments, a method for migrating the existing ASIC design comprises parsing the gate-level netlist one row at a time into one or more standard cells forming the ASIC design, forming a plurality of mapping tables having mapping rules for mapping the parsed one or more standard cells into equivalent target standard cells implemented in the second semiconductor fabrication process, mapping the parsed one or more standard cells into the equivalent target standard cells using the plurality of mapping tables, and generating a target gate-level netlist describing the ASIC design in terms of the equivalent target standard cells.

A method and system for migrating an existing ASIC design from one semiconductor fabrication process to another are disclosed herein. In some embodiments, a method for migrating the existing ASIC design comprises parsing the gate-level netlist one row at a time into one or more standard cells forming the ASIC design, forming a plurality of mapping tables having mapping rules for mapping the parsed one or more standard cells into equivalent target standard cells implemented in the second semiconductor fabrication process, mapping the parsed one or more standard cells into the equivalent target standard cells using the plurality of mapping tables, and generating a target gate-level netlist describing the ASIC design in terms of the equivalent target standard cells.

Methods of encoding and decoding are described which use a variable number of instruction words to encode instructions from an instruction set, such that different instructions within the instruction set may be encoded using different numbers of instruction words. To encode an instruction, the bits within the instruction are re-ordered and formed into instruction words based upon their variance as determined using empirical or simulation data. The bits in the instruction words are compared to corresponding predicted values and some or all of the instruction words that match the predicted values are omitted from the encoded instruction.

A method, an apparatus, and a system for checking a schematic circuit diagram are provided. The method includes: determining a netlist file and a bill of material (BOM) list of the schematic circuit diagram, where the schematic circuit diagram is drawn by an electronic design automation (EDA) tool; and determining whether parts in the schematic circuit diagram are in a preset part list and determining whether connection relationships among the parts meet preset connection relationships, according to the netlist file and the BOM list, to obtain a check result, where the preset part list includes standard part information of multiple parts.

A method, an apparatus, and a system for checking a schematic circuit diagram are provided. The method includes: determining a netlist file and a bill of material (BOM) list of the schematic circuit diagram, where the schematic circuit diagram is drawn by an electronic design automation (EDA) tool; and determining whether parts in the schematic circuit diagram are in a preset part list and determining whether connection relationships among the parts meet preset connection relationships, according to the netlist file and the BOM list, to obtain a check result, where the preset part list includes standard part information of multiple parts.

The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.

The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.

A method and system for migrating an existing ASIC design from one semiconductor fabrication process to another are disclosed herein. In some embodiments, a method for migrating the existing ASIC design comprises parsing the gate-level netlist one row at a time into one or more standard cells forming the ASIC design, forming a plurality of mapping tables having mapping rules for mapping the parsed one or more standard cells into equivalent target standard cells implemented in the second semiconductor fabrication process, mapping the parsed one or more standard cells into the equivalent target standard cells using the plurality of mapping tables, and generating a target gate-level netlist describing the ASIC design in terms of the equivalent target standard cells.