A computer-aided design system enables physical articles to be customized via printing or embroidering and enables digital content to be customized and electronically shared. A user interface may be generated that includes an image of a model of an article of manufacture and user customizable design areas that are graphically indicated on the image corresponding to the model. A design area selection may be received. In response to an add design element instruction and design element specification, the specified design element is rendered in the selected design area on the model image. Customization permissions associated with the selected design area are accessed, and using the customization permissions, a first set of design element edit tools are selected and rendered. User edits to the design element may be received and rendered in real time. Manufacturing instructions may be transmitted to a printing system.

An integrated circuit includes a standard cell including a first output pin and a second output pin configured to each output the same output signal, a first routing path connected to the first output pin, and a second routing path connected to the second output pin. The first routing path includes a first cell group including at least one load cell, the second routing path includes a second cell group including at least one load cell, and the first routing path and the second routing path are electrically disconnected from each other outside the standard cell.

An integrated circuit includes a standard cell including a first output pin and a second output pin configured to each output the same output signal, a first routing path connected to the first output pin, and a second routing path connected to the second output pin. The first routing path includes a first cell group including at least one load cell, the second routing path includes a second cell group including at least one load cell, and the first routing path and the second routing path are electrically disconnected from each other outside the standard cell.

A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.

A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.

Disclosed herein are related to performing layout verification of a layout design of an integrated circuit having a slanted layout component. In one aspect, the slanted layout component having a side slanted from a base axis is detected. In one aspect, an offset angle of the side of the slanted layout component with respect to the base axis is determined. In one aspect, the slanted layout component is rotated according to the offset angle to obtain a rotated layout component. The rotated layout component may have a rotated side in parallel with or perpendicular to the base axis. In one aspect, layout verification can be performed on the rotated layout component with respect to the base axis.

Disclosed herein are related to performing layout verification of a layout design of an integrated circuit having a slanted layout component. In one aspect, the slanted layout component having a side slanted from a base axis is detected. In one aspect, an offset angle of the side of the slanted layout component with respect to the base axis is determined. In one aspect, the slanted layout component is rotated according to the offset angle to obtain a rotated layout component. The rotated layout component may have a rotated side in parallel with or perpendicular to the base axis. In one aspect, layout verification can be performed on the rotated layout component with respect to the base axis.

A method of manufacturing a semiconductor device includes forming M_1st segments in a first metallization layer including: forming first and second M_1st segments for which corresponding long axes extend in a first direction and are substantially collinear, the first and second M_1st segments being free from another instance of M_1st segment being between the first and second M_1st segments; and (A) where the first and second M_1st segments are designated for corresponding voltage values having a difference equal to or less than a reference value, separating the first and second M_1st segments by a first gap; or (B) where the first and second M_1st segments are designated for corresponding voltage values having a difference greater than the reference value, separating the first and second M_1st segments by a second gap, a second size of the second gap being greater than a first size of the first gap.

A method of manufacturing a semiconductor device includes forming M_1st segments in a first metallization layer including: forming first and second M_1st segments for which corresponding long axes extend in a first direction and are substantially collinear, the first and second M_1st segments being free from another instance of M_1st segment being between the first and second M_1st segments; and (A) where the first and second M_1st segments are designated for corresponding voltage values having a difference equal to or less than a reference value, separating the first and second M_1st segments by a first gap; or (B) where the first and second M_1st segments are designated for corresponding voltage values having a difference greater than the reference value, separating the first and second M_1st segments by a second gap, a second size of the second gap being greater than a first size of the first gap.

A wiring quality test method includes the following: a respective wiring result topological structure and a respective expected topological structure corresponding to each signal to be tested in a set of signals to be tested are determined based on a wiring layout; for each signal to be tested, the wiring result topological structure is compared with the expected topological structure, to obtain a topological structure comparison result corresponding to the signal to be tested; in response to determining that the topological structure comparison result is greater than a preset threshold, it is determined a test result indicating that wiring for the signal to be tested is inappropriate; and a quality test report is generated based on test results of the signals to be tested.