A semiconductor chip comprising memory controller circuitry having interface circuitry to couple to a memory channel. The memory controller includes first logic circuitry to implement a first memory channel protocol on the memory channel. The first memory channel protocol is specific to a first volatile system memory technology. The interface also includes second logic circuitry to implement a second memory channel protocol on the memory channel. The second memory channel protocol is specific to a second non volatile system memory technology. The second memory channel protocol is a transactional protocol.

Implementations of the disclosed technology provide an electronic device including a semiconductor memory and a method for fabricating the same, in which processes are easily performed and the characteristics of a variable resistance element are improved. An electronic device according to an implementation of the disclosed technology is an electronic device including a semiconductor memory, wherein the semiconductor memory includes: a substrate; a conductive contact plug formed over the first conductive layer and including a stack of a conductive low-resistance structure and a conductive planarizing layer; and a variable resistance pattern coupled to the contact plug, wherein the low-resistance structure comprises a diffusion barrier layer, a low-resistance material layer and a gap-fill layer.

A memory having a delayed write-back to the array of data corresponding to a previously opened page allows delays associated with write-back operations to be avoided. After an initial activation opens a first page and the read/write operations for that page are complete, write-back of the open page to the array of memory cells is delayed until after completion of a subsequent activate operation that opens a new page. Techniques to force a write-back in the absence of another activate operation are also disclosed.

An electronic device may be provided to include: first and second active regions arranged adjacent to each other in a second direction; a gate structure extended in the second direction; a first source region and a first drain region formed in the first active region; a second source region and a second drain region formed in the second active region; a source line contact formed over the first and second source regions and connected to the first and second source regions; a source line connected to the source line contact over the source line contact and extended in a first direction; first and second stacked structures formed over the first and second drain regions; and first and second bit lines formed over the first and second stacked structures, wherein the first and second bit lines are extended in the first direction.

Examples of a multi-level memory with direct access are described. Examples include designating an amount of a non-volatile random access memory (NVRAM) for use as memory for a computer system. Examples also include designating a second amount of the NVRAM to for use as storage for the computing device. Examples also include re-designating at least a first portion of the first amount of NVRAM from use as memory to use as storage.

A semiconductor chip comprising memory controller circuitry having interface circuitry to couple to a memory channel. The memory controller includes first logic circuitry to implement a first memory channel protocol on the memory channel. The first memory channel protocol is specific to a first volatile system memory technology. The interface also includes second logic circuitry to implement a second memory channel protocol on the memory channel. The second memory channel protocol is specific to a second non volatile system memory technology. The second memory channel protocol is a transactional protocol

A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as far memory. Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as near memory.

Systems and methods for persistent operations include a host and a memory system. The memory system, upon receiving a Persistent Write command and associated write data from the host, performs a Persistent Write of the write data to a non-volatile memory in the memory system based on the Persistent Write command The memory system may also a receive a write identification (WID) associated with the Persistent Write command from the host and provide, upon successful completion of the Persistent Write, a Persistent Write completion indication along with the associated WID to the host.

A semiconductor device includes a resistance variable element including a free magnetic layer, a tunnel barrier layer and a pinned magnetic layer; and a magnetic correction layer disposed over the resistance variable element to be separated from the resistance variable element, and having a magnetization direction which is opposite to a magnetization direction of the pinned magnetic layer.

A method, non-transitory computer readable medium, and device that assists with caching filesystem metadata to a partner non-volatile random-access memory (NVRAM) includes caching metadata related to an incoming data modifying operation generated by a client computing device to at least one storage controller device in a cluster. A service interruption event that makes a data block present in the storage device of a hosting storage node inaccessible to the client computing device is determined for during the caching. The requested metadata block from the at least one NVRAM is retrieved when the service interruption event is determined. The cache is warmed using the retrieved metadata block from the at least one NVRAM.