According to one embodiment, a suspension assembly includes a support plate including a distal end and a proximal end portion, a wiring member including a gimbal portion and provided. on the support plate, and a magnetic head mounted on the gimbal portion. The gimbal portion includes a first end portion located on a side of the proximal end portion with respect to the magnetic head and welded to the support plate, a second end located on a side of the distal end portion with respect to the magnetic head and welded to the support plate, a tongue portion on which the magnetic head is mounted, located between the first end portion and the second end portion, and supported so as to be displaceable relative to the support plate, and a limiter opposing the tongue portion with a gap.

According to one embodiment, a disk device includes a first head actuator, a second head actuator, and a wiring board unit connected to the first head actuator and the second head actuator. The wiring board unit includes a flexible printed wiring board including a base portion and at least two extension portions extending from the base portion, and each of the extension portions includes a joint portion provided with connection pads and a cutting work trace portion. One joint portion is attached to a first actuator block, and the connection end portion of a first wiring member is joined to the connection pads. Another joint portion is attached to a second actuator block, and the connection end portion of a second wiring member is joined to the connection pad.

A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, includes write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities and further including a stacked interleaved part which includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities, is manufactured by a wiring step, an insulating layer forming step and a stacked interleaved part forming step.

According to one embodiment, a magnetic disk device includes a base that includes a bottom wall and side walls standing along a circumference of the bottom wall, a housing that includes a cover facing the bottom wall and closing the base, an actuator assembly that is housed inside the housing and is rotatable around a rotation axis, a head movably supported by the actuator assembly, a control circuit board provided outside of the housing, a first sensor disposed on the control circuit board, and a second sensor disposed inside the housing.

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.

A connecting device includes a first flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a first base portion, a junction portion extending between the bonding end and the first base portion, and a plurality of traces extending from the first base portion to the bonding end, a first connector that is mounted on the first base portion, a second flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a second base portion, a junction portion extending between the bonding end and the second base portion, and a plurality of traces extending from the second base portion to the bonding end, and a second connector that is mounted on the second base portion. The first connector and the second connector are disposed side by side in a same plane.

A suspension includes a first actuator arrangement portion and a second actuator arrangement portion. The first actuator arrangement portion includes a load beam frame portion formed of a part of the load beam. Both ends of a first actuator element are supported by the load beam frame portion. The second actuator arrangement portion includes a second load beam frame portion formed of a part of the load beam and a thin plate frame portion formed of a metal base of a flexure. One end of the second actuator element is supported by the second load beam frame portion. The other end of the second actuator element is supported by the thin plate frame portion.

An approach to forming an electronic device assembly that includes a plurality of interconnect pads on an electronic device, an interconnect die with a first set of interconnect pads adjacent to a first edge of the interconnect die connecting to a second set of interconnect pads adjacent to a second edge of the interconnect die, where a first set of connections between the plurality of interconnects on the electronic device and the first set of interconnect pads on the interconnect die occurs. Furthermore, the electronic assembly includes a second set of connections between the second set of interconnects on the interconnect die and a set of interconnect pads on a flex cable.

A flexure assembly is described. The flexure assembly includes a gimbal portion on configured to receive a slider. The gimbal portion includes a first surface and a second surface which is opposite to the first surface. The slider is mounted on the second surface. The flexure assembly also includes a pair of microactuator elements. The flexure assembly also includes a tongue of the gimbal portion on which the slider is mounted. The tongue includes a dimple point which represents the center of the tongue. The flexure assembly also includes a pair of first supporting portions and a pair of second supporting portions of the gimbal portion. A pair of end portions are individually secured to the tongue and the first supporting portions and the pair of second supporting portions. The flexure assembly also includes a conductive circuit portion unsupported between a first stationary part and the pair of end portions.