Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

According to one embodiment, a disk device includes a recording medium, electronic components including a magnetic head, a flexure, and an adhesive. The flexure includes a surface on which the electronic component is mounted, a first wiring and a second wiring each extending along the surface, and a groove provided on the surface between the first/second wirings. The adhesive is in contact with an inner surface of the groove and includes an adhesive portion attaching the electronic component to the surface. A first portion in the flexure is provided in a position apart from the electronic component. A second portion in the flexure is positioned closer to the adhesive portion than the first portion. A distance between the first wiring and the second wiring is larger than that in the first portion.

According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 μm above the exposed surface of the plurality of slider bond pads.

According to one embodiment, a head suspension assembly includes a support plate, a wiring member on the support plate, a head, and a piezoelectric element on the wiring member. The wiring member includes a metal plate and a multilayered member including a first insulating layer, a conducting layer, a second insulating layer, and connection pads formed from the conducting layer. Each of the connection pads is overlaid on a recess formed in the first insulating layer, so as to form a recessed portion along the recess, and the second insulating layer includes an opening opposing each of the connection pads. The piezoelectric element is connected to the connection pads by a conductive adhesive filled in the openings and the recessed portions of the connection pads.

In a disk drive having a flexible circuit tail that is routed within a recess in the actuator arm, a dielectric spacer is added to the top of the tail in order to space the circuit traces within the tail further away from the electrically conductive actuator arm, and to make more repeatable that spacing. The added spacing reduces electrical coupling and thus increases the bandwidth of the circuit. The spacer can be in the form of a section of the same viscoelastic material that is used elsewhere as a vibration dampener on the suspension, the viscoelastic material being adhered to the tail before the tail is inserted within the recess. Alternatively, the spacer can be a thickened region of the flexible circuit covercoat in the area where the tail will reside within the recess.