A disk apparatus includes recording disks and a first and a second actuator assembly that rotate about a support shaft and that each include: an actuator block; a wiring board having connection terminals and installed on an installation surface of the actuator block; and head assemblies each attached to the actuator block via an arm and each including a head and an interconnection member. The wiring board of each of the first and the second actuator assembly has a connection portion connected to one of the connection terminals and located adjacently to a boundary between the first and the second actuator assembly, and the connection portion of the first or the second actuator assembly is bent with respect to the installation surface.

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

A disk drive head suspension or flexure and method of manufacture. Embodiments include a portion such as a terminal pad or flying lead comprising a base layer, a dielectric layer on the base layer, a conductor layer, a seed layer between the dielectric layer and the conductor layer, and a noncorrosive metal layer on the seed layer side of the conductor layer. The seed layer has a strip that extends beyond the edge of the dielectric layer. The noncorrosive metal layer extends over the strip of the seed layer and into contact with the edge of the dielectric layer.

A circuit member includes a metal base, an insulating layer, a conductor, and a cover layer. A terminal portion includes a thick portion formed on a side part of the insulating layer, and an extension portion, which is a part of the conductor, overlapping the thick portion. The extension portion includes a side pad portion along a side surface of the thick portion. A side surface of the side pad portion constitutes a side pad extending in a thickness direction of the conductor. A length of the side pad in a thickness direction is greater than a thickness of the conductor. A side pad insulating portion, which is formed of a part of the thick portion, is formed between a distal end of the metal base and the side pad portion.

A disk retention system includes a spindle motor assembly with a spindle motor and an electromagnet retainer coupled and rotatable therewith, and a disk media assembly including a disk medium and a ferromagnetic material coupled therewith, whereby the disk is retained on the spindle motor by an adjustable attractive magnetic force between the ferromagnetic material of the disk assembly and the electromagnet retainer of the motor assembly. The motor assembly may further include a pair of stationary electrically-conductive liquid or liquid metal slip rings and a pair of rotatable electrical contacts each electrically coupled with a respective slip ring and with the electromagnet retainer, where the slip rings may utilize a Gallium-Indium-Tin alloy.

A circuit member includes a metal base, an insulating layer, a conductor, and a cover layer. A termial portion of the circuit member includes a thick portion formed at a part of the insulating layer, a conductor convex portion which is a part of the conductor, and overlaps the thick portion, and a conductor extending portion. By the conductor convex portion and the conductor extending portion, a stepped side pad is formed. The stepped side gad includes a first surface along the conductor extending portion, and a second surface which rises in a thickness direction of the conductor extending portion. The stepped side pad and an element are connected by a conductive member.

Embodiments of disk drive head suspensions are described that include a spring metal layer. The spring metal layer includes a base region, support arms extending from the base region, and a slider mounting region. The slider mounting region includes a proximal portion, a distal portion, and a pair of motor openings. The motor openings are configured to receive motors such that the longitudinal axes of the motors are non-parallel with the longitudinal axis of the slider mounting region. The suspensions include traces that include a base portion on the base region of the spring metal layer, a spring metal-unsupported portion extending from the base region to the slider mounting region, and a slider mounting portion extending from the spring metal-unsupported portion onto the slider mounting region. And, the suspensions include an insulating layer between portions of the spring metal layer and the conductor layer.

A magnetic head suspension assembly includes a support plate coupled to a magnetic head, and a flexible wiring member disposed on the support plate. The flexible wiring member includes a metal plate fixed to the support plate, an insulating layer disposed on the metal plate, a conductive layer disposed on the insulating layer and forming a plurality of conductive lines and connection terminals, and a cover layer on the conductive layer. The connection end portion includes a plurality of the connection terminals, and each of the connection terminals includes a center hole, a first terminal surface that is a surface of the conductive layer and is covered with the cover layer so that the first terminal surface is not exposed during a solder-joining process performed on the connection terminals, and a second terminal surface that is a surface of the conductive layer and faces away from the first terminal surface.

Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.