A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

A flexure of a disk drive suspension includes a metal base, and a wiring portion provided along the metal base. The wiring portion includes a base insulating layer, a conductor layer overlapping with the base insulating layer, and a cover insulating layer overlapping with the conductor layer, and the metal base includes a pair of first portions having side surfaces opposed to each other. At least one of the base insulating layer and the cover insulating layer is in contact with the side surfaces between the pair of first portions, and the conductor layer does not overlap with the metal base in a direction of stacking the wiring portion

according to one embodiment, a disk device includes a magnetic disk, a magnetic head, a first FPC, and a second FPC. The first FPC includes first terminals. The magnetic head is mounted on the first FPC and electrically connected to at least one of the first terminals. The second FPC includes a surface, second terminals on the surface, and a first ground plane. The second terminals are individually bonded to the corresponding first terminals with a conductive bonding material. The first ground plane covers at least one of the second terminals in a direction orthogonal to the surface. The second terminals include a first read terminal through which an electric signal representing information read from the magnetic disk by the magnetic head passes. The first ground plane is located apart from at least a part of the first read terminal in a direction along the surface.

According to one embodiment, a head suspension assembly includes a base plate including a first main surface, a second main surface opposing the first main surface, a distal end portion and a recess formed in the distal end portion on a side of the first main surface, a load beam including a proximal end portion disposed in the recess and fixed to a bottom surface of the recess and extending from the base plate, a wiring member disposed on the first main surface of the base plate and the load beam and a magnetic head supported by the load beam via the wiring member.

A head stack assembly (HSA) includes: a preamp having first contacts disposed on a first side and second contacts disposed on a second side which is opposite to the first side; a main actuator circuit disposed proximate the first side of the preamp and having Contacts configured to be electrically connected to the first contacts of the preamp; and a flexure/suspension circuit disposed proximate the second side of the preamp and having flexure/suspension circuit contacts configured to be directly electrically connected to the second contacts of the preamp.

A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

A flexure assembly is described. The flexure assembly includes a gimbal portion on configured to receive a slider. The gimbal portion includes a first surface and a second surface which is opposite to the first surface. The slider is mounted on the second surface. The flexure assembly also includes a pair of microactuator elements. The flexure assembly also includes a tongue of the gimbal portion on which the slider is mounted. The tongue includes a dimple point which represents the center of the tongue. The flexure assembly also includes a pair of first supporting portions and a pair of second supporting portions of the gimbal portion. A pair of end portions are individually secured to the tongue and the first supporting portions and the pair of second supporting portions. The flexure assembly also includes a conductive circuit portion unsupported between a first stationary part and the pair of end portions.

A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial wiring part that is on a space separated from the metal substrate. The base insulating layer of the aerial wiring part is formed to be thinner than that of the normal wiring part. This configuration reduces a rigidity contribution ratio of the wiring part.

A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.