Patent classifications
G11B5/486
Method for manufacturing a high-current printed circuit board
A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.
SUSPENSION ASSEMBLY AND DISK DEVICE
According to one embodiment, a flexure for use in a suspension assembly includes: a supporting plate; a wiring member including a metal plate and a wiring substrate placed on the metal plate and has a tip-side portion placed on the supporting plate, a base end-side portion extending to an outside of the supporting plate, and a first end provided at an extension end of the base end-side portion; and a piezoelectric element mounted on the wiring member. The wiring substrate includes an insulating layer and a conductive layer stacked on the insulating layer, the conductive layer having a plurality of connecting pads including a ground pad to which a ground electrode of the piezoelectric element is connected, a plurality of connecting terminals provided at the first end and including a ground terminal, and a plurality of traces including a ground trace connecting the ground pad and the ground terminal.
DISK DEVICE
A disk device includes magnetic disks, a magnetic head, a suspension, and a carriage. The suspension includes a flexible substrate on which the magnetic head is mounted. The carriage includes an arm to which the suspension is attached. The arm includes opposing first and second end surfaces, a side surface extending between the first end surface and the second end surface, and a protruding body that protrudes from the side surface and has a first surface parallel to and spaced apart from the first end surface and a second surface parallel to and spaced apart from the second end surface. The flexible substrate includes a strip extending along the side surface. The strip includes a portion positioned between the first end surface and the protruding body in the axial direction and is positioned between the first end surface and the second end surface in the axial direction.
Head gimbal assembly for hard disk drive device
A gimbal having a base portion and a tongue joined together by a neck portion. The base portion includes a first proximal edge facing away from the tongue. A circuit is mounted on the gimbal and includes a portion mounted to the base portion having a circuit extension region that extends beyond the first proximal edge. The circuit extension region includes a second proximal edge facing away from the tongue. A slider may be mounted on the tongue and electrically connected to the circuit. First and second PZT actuators are mounted to the head gimbal assembly and electrically connected to the circuit. The circuit extension region has a circuit extension region width W of at least 0.1 mm as measured in a direction extending away from the tongue relative to a furthest extending portion of the first proximal edge and a furthest extending portion of the second proximal edge.
Hard disk drive suspension pad pre-solder sidewalls
A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.
CO-LOCATED GIMBAL-BASED DUAL STAGE ACTUATION DISK DRIVE HEAD SUSPENSION WITH NON-PARALLEL MOTORS
Embodiments of disk drive head suspensions are described that include a spring metal layer. The spring metal layer includes a base region, support arms extending from the base region, and a slider mounting region. The slider mounting region includes a proximal portion, a distal portion, and a pair of motor openings. The motor openings are configured to receive motors such that the longitudinal axes of the motors are non-parallel with the longitudinal axis of the slider mounting region. The suspensions include traces that include a base portion on the base region of the spring metal layer, a spring metal-unsupported portion extending from the base region to the slider mounting region, and a slider mounting portion extending from the spring metal-unsupported portion onto the slider mounting region. And, the suspensions include an insulating layer between portions of the spring metal layer and the conductor layer.
Printed circuit board and method for manufacturing the same
A printed circuit board includes a circuit substrate and a plurality of buffering circuits. The circuit substrate includes a substrate layer, and first and second circuit layers formed on either side of the substrate layer. The first circuit layer comprises a plurality of first conductive circuits. The second circuit layer comprises a plurality of second conductive circuits. A line width of each of the plurality of first conductive circuits is greater than a line width of each of the plurality of second conductive circuits. The plurality of buffering circuits electrically connect the first circuit layer to the second circuit layer and a line width of each of the plurality of buffering circuits is greater than the line width of each of the plurality of second conductive circuits.
Dual stage actuated suspension having shear-mode PZT actuators for rotating gimbal tongue
A dual stage actuated (DSA) suspension uses two shear-mode PZT microactuators to finely position the head slider. The bottom surfaces of the PZTs are affixed to the flexure, and the PZT top surfaces move forward and backward, respectively, in push-pull fashion when the PZTs are activated. Flexible connector arms attach the tops surfaces of the PZTs to the gimbal tongue such that activating the PZTs causes the gimbal tongue to rotate, with the connector arms acting as levers to magnify the motion such that a relatively small shear movement of the PZTs results in a significantly larger lateral movement of the head slider across the data disk.
Disk apparatus and dual actuator assembly having a wiring board with a bent connection portion
A disk apparatus includes recording disks and a first and a second actuator assembly that rotate about a support shaft and that each include: an actuator block; a wiring board having connection terminals and installed on an installation surface of the actuator block; and head assemblies each attached to the actuator block via an arm and each including a head and an interconnection member. The wiring board of each of the first and the second actuator assembly has a connection portion connected to one of the connection terminals and located adjacently to a boundary between the first and the second actuator assembly, and the connection portion of the first or the second actuator assembly is bent with respect to the installation surface.
Stripe height lapping control structures for a multiple sensor array
A method and system provide a storage device. A plurality of read sensor stacks for each reader of the storage device are provided. The read sensor stacks are distributed along a down track direction and offset in a cross-track direction. A plurality of electronic lapping guides (ELGs) are provided for the read sensor stacks. The read sensor stacks are lapped. Lapping is terminated based on signal(s) from the ELG(s).