The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

A slot module and an electronic device using the same are provided. The slot module includes a base, a slot member, a heat sink and a position limiting member. One end of the slot member is pivotally connected to the base, such that the slot member is adapted to rotate relative to the base, and a functional element is adapted to be inserted into the slot member. The heat sink and the position limiting member are all disposed on the base, wherein the position limiting member is adapted to be rotated from a first position to a second position to buckle the slot member, such that the functional component inserted into the slot member contacts the heat sink.

A heat sink can be used as part of a storage drive to perform multiple functions, both structural and thermodynamic. It can be used as a heat dissipating element and it can be used as the key mechanical mounting structure for storage drives, such as hard disk drives (HDD), and any circuit boards.

A pluggable electronic device includes a base, a heat source module and an upper cover. The base is made of a metal material. The heat source is disposed at the base. The upper cover covers the heat source module, is connected to the base, and includes an enclosed cavity and an operating fluid cyclically performing evaporation and condensation in the enclosed cavity.

A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.

A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.

The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

Examples herein relate to non-volatile memory (NVM) drives. In one example, an NVM drive comprises a housing to support one or more printed circuit assemblies (PCA's), the housing comprising a front portion, a rear portion and a heat sink, a PCA disposed within the housing, the PCA comprising a connector, one or more NVM chips and a controller attached to the one or more NVM chips. The PCA is centered in the housing, the NVM drive is hot-plugged into a fabric attached memory pool or local to a server by the rear portion of the housing, and the NVM drive hot-plugged in the fabric attached memory pool is accessible by the front portion of the housing.

An electronic module and a heat dissipation assembly thereof are provided. The electronic module includes an electronic component between a bottom of a heat fin and a bottom plate of a base, and a heat dissipation assembly including the heat fin, the base, and multiple fasteners. Each of two opposite sides of the bottom has a pair of first and second screw holes. The first screw holes are between the second screw holes. The base has a pair of side walls extending vertically from opposite sides of the bottom plate. Each side wall has a pair of third and fourth screw holes. The third screw holes correspond to the first screw holes and the fourth screw holes correspond to the second screw holes. The fasteners pass through the corresponding third and first screw holes or pass through the corresponding fourth and second screw holes.

A metamaterial heat spreader includes a base, and a projection. The base is configured to be attached to a first surface of a heat generation component. The projection is continuous with and extends away from the base such that the projection is configured to be spaced apart from and overlap a second surface of the heat generation component. The projection is constituted by a metal with a periodic pattern. The projection is configured to have a high impedance surface (HIS).