A semiconductor device and a method for controlling body bias thereof capable of properly controlling body bias of a transistor even in a case where process variation occurs are provided. Operation speeds of ring oscillators ROSCn and ROSCp respectively change due to an influence of process variation at an NMOS transistor MN side and a PMOS transistor MP side. Speed/bias data represent a correspondence relationship between the operation speeds of the ring oscillators ROSCn and ROSCp and set values V1n and V1p of body biases VBN and VBP. A body bias controller receives speed values Sn and Sp measured for the ring oscillators ROSCn and ROSCp to which the body biases VBN and VBP based on default values are respectively applied, and obtains the set values V1n and V1p on the basis of the speed/bias data.

A memory device includes: a first circuit; a second circuit; and an adaptive body bias generator configured to receive frequency detection information or temperature detection information, to apply a first forward body bias or a first reverse body bias to the first circuit in response to the frequency detection information or the temperature detection information, and to apply a second forward body bias or a second reverse body bias to the second circuit in response to the frequency detection information or the temperature detection information.

To provide a semiconductor device which can be stably operated while achieving a reduction of the power consumption.

A semiconductor device includes a CPU, a system controller which designates an operation speed of the CPU, P-type SOTB transistors, and N-type SOTB transistors. The semiconductor device is provided with an SRAM which is connected to the CPU, and a substrate bias circuit which is connected to the system controller and is capable of supplying substrate bias voltages to the P-type SOTB transistors and the N-type SOTB transistors. Here, when the system controller designates a low speed mode to operate the CPU at a low speed, the substrate bias circuit supplies the substrate bias voltages to the P-type SOTB transistors and the N-type SOTB transistors.

The present disclosure provides a method for programming charge trap flash memory, including: enabling a channel of a charge trap storage component, to form a transverse electric field between a source and a drain, to generate primary electrons flowing from the source to the drain; colliding, by the primary electrons after a preset time, with the drain to generate electron holes; applying voltages to the drain and a substrate, where the electron holes are accelerated downward by the action of the electric field to collide with the substrate, to generate secondary electrons; and applying voltages to a gate and the substrate, to form a vertical electric field, wherein the secondary electrons generate tertiary electrons under the action of the vertical electric field and the tertiary electrons are injected into an insulating storage medium layer of the charge trap storage component, to complete a programming operation.

Various implementations described herein are related to a device having memory circuitry with a bitcell array. The device may include a frontside power network that is coupled to the bitcell array, and the device may include a backside power network that provides power to the bitcell array. The device may include transition vias that couple the backside power network to the frontside power network, and the backside power network may provide power to the bitcell array by way of the transition vias being coupled to the frontside power network.

A physical unclonable function (PUF)-based method for enhancing system reliability is provided, including: requesting, by a client, data transmission with a server; randomly selecting, by the server, a plurality of metal oxide semiconductor (MOS) devices in an MOS array, and acquiring positional information of the plurality of MOS devices; calculating, by the server, a probabilistic PUF that the trap in each of the plurality of MOS devices is occupied by a carrier and constructing a probabilistic model; randomly generating, by the server, detection time according to the probabilistic model and sending the detection time and the positional information to the client; and determining, by the server, an occupancy probability of the trap in each of the plurality of MOS devices at the detection time according to the probabilistic model, and generating a theoretical code key.

A method for regulating the memory includes operations as follows. A mapping relationship among temperatures of a transistor, body bias voltages of the transistor, and data writing time of the memory is acquired, a current temperature of the transistor is acquired, the body bias voltage is regulated based on the current temperature and the mapping relationship, to enable the data writing time corresponding to the regulated body bias voltage to be within a preset writing time.

Various implementations described herein are related to a device having memory circuitry with a bitcell array. The device may include a frontside power network that is coupled to the bitcell array, and the device may include a backside power network that provides power to the bitcell array. The device may include transition vias that couple the backside power network to the frontside power network, and the backside power network may provide power to the bitcell array by way of the transition vias being coupled to the frontside power network.

A memory device includes: a first circuit; a second circuit; and an adaptive body bias generator configured to receive frequency detection information or temperature detection information, to apply a first forward body bias or a first reverse body bias to the first circuit in response to the frequency detection information or the temperature detection information, and to apply a second forward body bias or a second reverse body bias to the second circuit in response to the frequency detection information or the temperature detection information.

Apparatuses and techniques are described for reducing read time in a memory device. A source voltage signal, Vcelsrc, and a body voltage signal, Vp-well, of a source region and a p-well, respectively, of a substrate of a NAND string are controlled to reduce the channel resistance. Vcelsrc can be temporarily reduced, e.g., provided with a negative voltage kick, while Vp-well is non-decreasing during a read operation. The negative voltage kick decreases a body bias of the NAND string in its channel to reduce the channel resistance and increase the current. The negative voltage kick can be initiated when a bit line clamp transistor is made conductive to allow a current to flow in the NAND string. The magnitude and duration of the negative voltage kick can be adjusted based on various factors.