A memory device includes a memory cell array and a peripheral circuit. The memory cell array includes a plurality of memory regions each identified by a row address and a column address. The peripheral circuit accesses the memory cell array by performing, based on an address, a burst length and a burst address gap provided from a memory controller, a burst operation supporting a variable burst address gap. The burst address gap is a numerical difference between adjacent column addresses, on which the burst operation is to be performed.

A memory system includes a host circuit and a memory circuit. The host circuit controls a bandwidth of a command-address signal based on data driving cycle information. The memory circuit performs an input/output operation based on the command-address signal.

Disclosed are methods for reading data from a storage buffer. One such method may include retrieving a first set of data during a first period of time. The method may also include delaying data retrieval during a second period of time after the first period of time. The method may include outputting at least a portion of the first set of data during the first period of time and the second period of time. The first period of time is substantially similar to the second period of time.

Apparatuses and methods for writing data to a memory array are disclosed. When data is duplicative across multiple data lines, data may be transferred across a single line of a bus rather than driving the duplicative data across all of the data lines. The data from the single data line may be provided to the write amplifiers of the additional data lines to provide the data from all of the data lines to be written to the memory. In some examples, error correction may be performed on data from the single data line rather than all of the data lines.

A memory is provided that is configured to practice two different modes of read operation, such as both a normal read operation and a burst-mode read operation. In one example, the memory is a pseudo-dual-port memory. The memory may include an address comparator to perform a time-division multiplexing to first compare a read address to a stored address and then to compare a write address to the stored address.

Disclosed are methods for reading data from a storage buffer. One such method may include retrieving a first set of data during a first period of time. The method may also include delaying data retrieval during a second period of time after the first period of time. The method may include outputting at least a portion of the first set of data during the first period of time and the second period of time. The first period of time is substantially similar to the second period of time.

A memory device includes an external information input circuit configured to generate a burst mode signal and a write command pulse for a write operation, by receiving external information for the write operation; and a write operation control circuit configured to generate a write control pulse for storing internal data in a cell array, from the write command pulse when a first burst mode is performed on the basis of the burst mode signal, and to control whether to generate the write control pulse from the write command pulse when a second burst mode is performed on the basis of the burst mode signal.

A system and method for double data rate (DDR) chip-kill decoding using an array of ECC erasure decoders operating in parallel to identify a location of a chip-kill event associated with a DDR memory device. The ECC erasure decoder that correctly identifies the chip-kill location is then used to decode subsequent DDR bursts transmitted from the DDR memory device.

An address latch includes a first address processing unit and a second address processing unit. The first address processing unit latches an external address signals to output first latched signals through an output node based on a read command and a write command. The second address processing unit latches the external address signals based on the read command with a burst length set to a first value and outputs second latched signals through the output node based on an internal read command.

Some memory dies in a stack can be connected externally to the stack and other memory dies in the stack can be connected internally to the stack. The memory dies that are connected externally can act as interface dies for other memory dies that are connected internally thereto. The external connections can be used for transmitting signals indicative of data to and/or from the memory dies while the memory dies in the stack can be connected by a cascading connection for transmission of other signals such as command, address, power, ground, etc.