A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller includes an error correction code (ECC) circuit. The ECC circuit is configured to determine data rows of first write data that are not all zeros and store the determined data rows in buffer rows of a buffer along with corresponding row indexes. The memory controller is configured to write second data based on the buffer to the memory device.

An integrated circuit (IC) includes first and scan latches that are enabled to load data during a first part of a clock period. A clocking circuit outputs latch clocks with one latch clock driven to an active state during a second part of the clock period dependent on a first address input. A set of storage elements have inputs coupled to the output of the first scan latch and are respectively coupled to a latch clock to load data during a time that their respective latch clock is in an active state. A selector circuit is coupled to outputs of the first set of storage elements and outputs a value from one output based on a second address input. The second scan latch then loads data from the selector's output during the first part of the input clock period.

A page buffer includes a charging circuit, first and second storage circuits, and a selection circuit. The charging circuit charges a bit line during a precharging period. The first storage circuit determines and stores data corresponding to a state of a selected memory cell among memory cells connected to the bit line while the charging circuit charges the bit line. The second storage circuit, which is a circuit separate from the first storage circuit, determines and stores data corresponding to a state of the selected memory cell after the precharging period. The selection circuit outputs a control voltage controlling a switch element connected between the bit line and the charging circuit, and determines a magnitude of the control voltage during the precharging period, based on the data stored in the first storage circuit.

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

A command decoder circuit, a memory, and an electronic device are provided. The circuit includes a first decoder unit, configured to perform decoding for a first command signal based on a dynamic clock signal; a second decoder unit, configured to perform decoding for a second command signal based on the dynamic clock signal; and the clock gate, configured to generate the dynamic clock signal after a chip select signal of the first decoder unit indicates that decoding to be started for the first command signal and before the second decoder unit has performed decoding for the second command signal, and cut off the dynamic clock signal before the chip select signal of the first decoder unit indicates that the decoding to be started for the first command signal or after the second decoder unit has performed decoding for the second command signal.

A processing-in-memory (PIM) device includes a plurality of multiplication and accumulation (MAC) units, each of the MAC units including a memory bank and a MAC operator, and a control circuit configured to control the plurality of MAC units to perform an all MAC mode operation in which MAC operations are performed in all MAC units, among the plurality of MAC units, or a dispersion MAC mode operation in which the MAC operations are performed in some MAC units, among the plurality of MAC units.

A semiconductor device including a FIFO circuit in which a data capacity can be increased while minimizing an increase in a circuit scale is provided. The semiconductor device includes a single-port type storage unit (11) which stores data, a flip-flop (12) which temporarily stores write data (FIFO input) or read data (FIFO output) of the storage unit (11), and a control unit (14, 40) which controls a write timing of a data signal, which is stored in the flip-flop (12), to the storage unit (11) or a read timing of the data signal from the storage unit to avoid an overlap between a write operation and a read operation in the storage unit (11).

A memory device includes an external information input circuit configured to generate a burst mode signal and a write command pulse for a write operation, by receiving external information for the write operation; and a write operation control circuit configured to generate a write control pulse for storing internal data in a cell array, from the write command pulse when a first burst mode is performed on the basis of the burst mode signal, and to control whether to generate the write control pulse from the write command pulse when a second burst mode is performed on the basis of the burst mode signal.

A nonvolatile memory device includes an array of magnetic memory cells, and control logic circuit having a voltage generator therein, which is configured to generate a gate voltage. A row decoder is provided, which is connected by word lines to the array of magnetic memory cells, and has a word line driver driven therein, which is responsive to the gate voltage. A column decoder is provided, which is connected by bit lines and source lines to the array of magnetic memory cells. A write driver is provided, which has a write voltage generating circuit therein that is configured to output a write voltage, in response to: (i) a reference voltage generated using a replica magnetic memory cell, and (ii) a feedback voltage generated using a magnetic memory cell in which a write operation is to be performed.

The invention relates to a method for operating a memory assembly. A physical address is received. The physical address is associated with a first memory segment of a memory assembly. The physical address is modified to a modified physical address. The modified physical address is associated with a second memory segment of the memory assembly.