A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

Implementations described and claimed herein provide a high-capacity, high-bandwidth scalable storage device. The scalable storage device includes a layer stack including at least one memory layer and at least one optical control layer positioned adjacent to the memory layer. The memory layer includes a plurality of memory cells and the optical control layer is adapted to receive optically-encoded read/write signals and to effect read and write operations to the plurality of memory cells through an electrical interface.

Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.

An apparatus is described. The apparatus includes a logic chip upon which a stack of memory chips is to be placed. The stack of memory chips and the logic chip to be placed within a same package, wherein, multiple memory chips of the stack of memory chips are divided into fractions, and, multiple internal channels within the package that emanate from the logic chip are to be coupled to respective ones of the fractions. The logic chip has a multiplexer. The multiplexer is to multiplex a single input/output (I/O) channel of the package to the multiple internal channels.

A semiconductor storing apparatus capable of performing continuous readout between multiple chips in high speed is provided. A NAND-type flash memory includes the stacked multiple chips. Each of the chips includes: a readout part performing the continuous readout; an output buffer part outputting data readout from the readout part to input/output bus synchronously with a clock signal; and a final page detecting part detecting if readout pages are the final pages of the chips. The output buffer part responds to a detecting result of the final pages under a condition of performing the continuous readout between the chips. After outputting the data of the final pages through a first output buffer with a large driving capability, outputs or holds the data of the final pages through a second output buffer with a little driving capability.

Systems and methods for an optical ternary content addressable memory (TCAM) are provided. The optical TCAM implements a time-division multiplexing (TDM) based encoding scheme to encode each bit position of a search word in the time domain. Each bit position is associated with at least two time slots. The encoded optical signal comprising the search word is routed through one or more modulators configured to represent a respective TCAM stored word. If a mismatch between at least one bit position of the search word and at least one TCAM stored word occurs, a photodetector or photodetector array will detect light.

A method is described. The method includes configuring first register space to establish ODT values of a data strobe signal trace of a DDR data bus. The method also includes configuring second register space to establish ODT values of a data signal trace of the DDR data bus. The ODT values for the data strobe signal trace are different than the ODT values for the data signal trace. The ODT values for the data strobe signal do not change when consecutive write operations of the DDR bus write to different ranks of a same DIMM.

A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

A memory system includes: a memory device including a memory cell array and a page buffer circuit, the memory device performing a data program operation or a data erase operation, suspending the data program operation or the data erase operation in response to a suspend command, performing a data read operation of storing read data from the memory cell array in the page buffer circuit in response to a read command, and performing a data output operation of outputting the read data stored in the page buffer circuit; and a memory controller outputting a pre-resume command to the memory device between a first time at which the data read operation is complete and a second time at which the data output operation starts.