A non-volatile memory system implements the writing of data by decoupling the write transfer and the write operation. One embodiment includes setting up a write operation for a first memory die to write to a first address and performing a data transfer to the first memory die for the write operation in response to the determining that sufficient resources exist to perform a data transfer. The first memory die is subsequently released from the write operation without the first memory die writing the transferred data so that the first memory die is in an idle state. In response to determining that sufficient resources exist to perform the write operation, the first memory die is instructed to write the transferred data to the first address in non-volatile memory on the first memory die without re-transferring the data.

A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that are vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.

Provided is a nonvolatile memory including a receive buffer configured to generate a buffer signal by comparing an input signal with a reference voltage, a reference voltage calibrator configured to generate a calibrated reference voltage code signal based on a reference voltage code signal and the buffer signal, and a reference voltage generator configured to generate a reference voltage corresponding to the calibrated reference voltage code signal. In addition, the read reference voltage calibrator includes a duty cycle monitor configured to generate a monitoring signal by measuring a duty cycle of the buffer signal, an up/down counter configured to generate a count number signal by comparing a reference duty cycle with a measurement duty cycle corresponding to the monitoring signal, and a code calculator configured to generate the calibrated reference voltage code signal based on the count number signal and the reference voltage code signal.

An input circuit may include: an internal bias generation unit suitable for generating first and second bias voltages in response to a first enable signal; a buffer control unit suitable for comparing a reference voltage to the first and second bias voltages, and generating a plurality of buffer control signals based upon the comparison of the reference voltage with the first and second bias voltages; and a buffer unit including a plurality of buffers, wherein a buffer is driven to receive the reference voltage and an external input signal, and generates an internal signal, in response to an activated buffer control signal among the plurality of buffer control signals.

Provided herein are a data input/output circuit and a semiconductor memory system having the same. The data input/output circuit may be coupled to an input/output line. The data input/output circuit may include a data input unit and a data output unit. The data input unit may deliver input data, inputted through the input/output line, to a page buffer during a data input period. The data output unit may deliver output data, outputted from the page buffer, to the input/output line during a data output period. The data input unit may include a signal reception unit coupled to the input/output line and configured to receive the input data from the input/output line; and a data delivery unit configured to deliver the input data inputted to the signal reception unit to the page buffer during the data input period.

An input circuit may include: an internal bias generation unit suitable for generating first and second bias voltages in response to a first enable signal; a buffer control unit suitable for comparing a reference voltage to the first and second bias voltages, and generating a plurality of buffer control signals based upon the comparison of the reference voltage with the first and second bias voltages; and a buffer unit including a plurality of buffers, wherein a buffer is driven to receive the reference voltage and an external input signal, and generates an internal signal, in response to an activated buffer control signal among the plurality of buffer control signals.

A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.

A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that are vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.

The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.