A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

There are provided a memory device for supporting a command bus training (CBT) mode and a method of operating the same. The memory device is configured to enter a CBT mode or exit from the CBT mode in response to a logic level of a first data signal, which is not included in second data signals, which are in one-to-one correspondence with command/address signals, which are used to output a CBT pattern in the CBT mode. The memory device is further configured to change a reference voltage value in accordance with a second reference voltage setting code received by terminals associated with the second data signals, to terminate the command/address signals or a pair of data clock signals to a resistance value corresponding to an on-die termination (ODT) code setting stored in a mode register, and to turn off ODT of data signals in the CBT mode.

A memory is provided that includes a write multiplexer, which multiplexes among a plurality of bit line columns. The multiplexer includes a positive boost circuit that applies a positive boost to a voltage at the gates of transistors to strengthen an on state of those transistors. The positive boosting may be in addition to, or instead of, negative boosting at a write driver circuit.

A device, a memory interface device, and a method of implementing an active inductor circuit are disclosed. In one aspect, the device includes one or more active inductor circuits, each including a first metal-oxide-semiconductor (MOS) transistor and a second MOS transistor. The first MOS transistor has a first terminal connected to a first voltage level, a second terminal connected to a resistor, and a gate terminal. The second MOS transistor has a first terminal connected to the first voltage level, a second terminal connected to a first current source and the gate terminal of the first MOS transistor, and a gate terminal connected to the resistor and to a capacitor connected to a second voltage level. One of the first MOS transistor and the second MOS transistor is a p-channel MOS (PMOS) transistor, and another of the first MOS transistor and the second MOS transistor is an n-channel MOS (NMOS) transistor.

A memory device includes: a memory bank including a plurality of memory cells; and a memory interface circuit configured to store data in the plurality of memory cells based on a command/address signal and a data signal, wherein the memory interface circuit includes: first, second, third and fourth pads configured to receive first, second, third and fourth clock signals, respectively; a first buffer circuit configured to sample the command/address signal in response to an activation time of the first and third clock signals which have opposite phases from each other; and a second buffer circuit configured to sample the data signal in response to the activation time of the first clock signal, an activation time of the second clock signal, the activation time of the third clock signal and an activation time of the fourth clock signal.

A device includes a multiplication unit and a configurable summing unit. The multiplication unit is configured to receive data and weights for an Nth layer, where N is a positive integer. The multiplication unit is configured to multiply the data by the weights to provide multiplication results. The configurable summing unit is configured by Nth layer values to receive an Nth layer number of inputs and perform an Nth layer number of additions, and to sum the multiplication results and provide a configurable summing unit output.

A serial data buffer integrated circuit comprises unidirectional host-side input and output ports, and unidirectional memory-side input and output ports. Scheduling logic generates memory device commands for writing to and reading from a memory device based on a set of host-side input packets received from a memory controller. A unidirectional serial host side input port receives host-side input packets from the memory controller. A unidirectional serial memory side output port transmits the memory device commands and the write data to the memory device based on the scheduled timing. A unidirectional serial memory side input port receives read data from the memory device in response to a read command, and a unidirectional serial host side output port transmits the read data to the memory controller within the timing constraints of the memory device.

A semiconductor device comprises: a first or a second path configured to transmit a first signal which swings between a ground level and a first level, a third path configured to transmit a second signal which swings between the ground level and a second level lower than the first level, a transmitter configured to output received the first signal through the first or second path as the second signal to the third path, and initialize in response to an enable signal, and a receiver configured to output received the second signal through the third path as the first signal through the first or second path, determine level of the second signal through a reference level that is regulated according to a fed-back level of an output terminal thereof, and initialize in response to the enable signal.

A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.

A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.