Methods, systems, and devices for signal sampling with offset calibration are described. For example, sampling circuitry may include an input pair of transistors where input signals may be provided to gate nodes of the transistors, and an output signal may be generated based on a comparison of voltages of drain nodes of the transistors. In some examples, source nodes of the transistors may be coupled with each other, such as via a resistance, and each source node may be configured to be coupled with a ground node. In some examples, a conductive path between the source nodes may be coupled with one or more switching components configurable for further coupling of the source nodes with the ground node. In some examples, enabling such switching components may add an electrical characteristic (e.g., capacitance) to the conductive path between the source nodes, which may be configurable to mitigate sampling circuitry imbalances.

A semiconductor memory device includes a quadrature error correction circuit, a clock generation circuit and a data input/output (I/O) buffer. The quadrature error correction circuit performs a locking operation to generate a first corrected clock signal and a second corrected clock signal by adjusting a skew and a duty error of a first through fourth clock signals generated based on a data clock signal and performs a relocking operation to lock the second corrected clock signal to the first corrected clock signal in response to a relock signal. The clock generation circuit generates an output clock signal and a strobe signal based on the first corrected clock signal and the second corrected clock signal. The data I/O buffer generates a data signal by sampling data from a memory cell array based on the output clock signal and transmits the data signal and the strobe signal to a memory controller.

A signal sampling circuit includes the following: a signal input circuit, configured to determine a to-be-processed instruction signal and a to-be-processed chip select signal; a first instruction sampling circuit, configured to perform two-stage sampling and logic operation processing on the to-be-processed chip select signal according to a first clock signal to obtain a first chip select clock signal; a second instruction sampling circuit, configured to perform two-stage sampling and logic operation processing on the to-be-processed chip select signal according to the first clock signal to obtain a second chip select clock signal; and an instruction decoding circuit, configured to perform decoding and sampling processing on the to-be-processed instruction signal according to be to-be-processed chip select signal and one of the first chip select clock signal and the second chip select clock signal to obtain a target instruction signal.

Methods of operating a memory device are disclosed. A method may include asserting, at a semiconductor device, an internal signal in response to receipt of a command. The method may also include holding the internal signal in an asserted state for at least a predetermined time duration upon assertion of the internal signal. Further, the method may include generating an enable signal based on the internal signal and a clock signal. Associated devices and systems are also disclosed.

Memory devices and methods of operating memory devices in which maintenance operations can be scheduled on an as-needed basis for those memory portions where activity (e.g., operations in excess of a predetermined threshold) warrants a maintenance operation are disclosed. In one embodiment, an apparatus comprises a memory including a memory location, and circuitry configured to determine a count corresponding to a number of operations at the memory location, to schedule a maintenance operation for the memory location in response to the count exceeding a first predetermined threshold, and to decrease the count by an amount corresponding to the first predetermined threshold in response to executing the scheduled maintenance operation. The circuitry may be further configured to disallow, in response to determining that the count has reached a maximum permitted value, further operations at the memory location until after the count has been decreased.

Various embodiments described herein provide for operation of a memory sub-system based on a profile (also referred to herein as an operational profile) that causes the memory sub-system to have a specific set of operational characteristics. Additionally, some embodiments can provide dynamic switching between profiles based on a set of conditions being satisfied, such as current time of day or detection of a particular data input/out (I/O) pattern with respect to the memory sub-system.

The present technology relates to an electronic device. According to the present technology, a memory controller may include a training controller, a training data storage, and a machine learning processor. The training controller may perform training of correcting interface signals exchanged with a memory device, generate training data that is a result of the training, and output the training data as sample training data based on a comparison result of a training reference and the training data. The training data storage may store training history information including plural pieces of sample training data. The machine learning processor may update the training reference through machine learning based on the training history information.

An electronic system includes a controller configured to detect a bank in a standby state for a write operation between a first bank and a second bank during a refresh operation period and output data for performing a post-write operation to the bank in the standby state for the write operation. The electronic system also includes an electronic device including the first and second banks. The electronic device is configured to latch the data in an input/output control circuit connected to the bank in the standby state for the write operation.

A memory device and a glitch prevention method thereof are provided. The memory device includes a data strobe signal input circuitry, a transfer signal generating circuitry, a data alignment circuitry, and a blocking circuitry. The data strobe signal input circuitry is configured to input a data strobe signal. The transfer signal generating circuitry is configured to generate a transfer signal with pulses in synchronization with rising edges or falling edges of the data strobe signal in response to a transfer command. The data alignment circuitry is configured to align a data signal to be transferred in response to the generated transfer signal. The blocking circuitry is configured to block an input of the data strobe signal over a postamble timing of the data strobe signal according to a number of bursts counted in each time of data transfer.

A data storage system includes a storage medium including a plurality of memory cells; a storage controller in communication with the storage medium; and an electrical interface between the storage medium and the storage controller. The electrical interface includes an N-bit data bus; a data strobe; a command latch enable signal; and an address latch enable signal; wherein, while the command latch signal or the address latch enable signal is asserted, the storage medium is configured to: (i) receive command or address data via a subset of lines of the data bus; and (ii) latch the command or address data using the data strobe.