A chalcogenide material may include germanium (Ge), arsenic (As), selenium (Se) and from 0.5 to 10 at % of at least one group 13 element. A variable resistance memory device may include a first electrode, a second electrode, and a chalcogenide film interposed between the first electrode and the second electrode and including from 0.5 to 10 at % of at least one group 13 element. In addition, an electronic device may include a semiconductor memory. The semiconductor memory may include a column line, a row line intersecting the column line, and a memory cell positioned between the column line and the row line, wherein the memory cell comprises a chalcogenide film including germanium (Ge), arsenic (As), selenium (Se), and from 0.5 to 10 at % of at least one group 13 element.

Methods, systems, and devices for a modified write voltage for memory devices are described. In an example, the memory device may determine a first set of memory cells to be switched from a first logic state (e.g., a SET state) to a second logic state (e.g., a RESET state) based on a received write command. The memory device may perform a read operation to determine a subset of the first set of memory cells (e.g., a second set of memory cells) having a conductance threshold satisfying a criteria based on a predicted drift of the memory cells. The memory device may apply a RESET pulse to each of the memory cells within the first set of memory cells, where the RESET pulse applied to the second set of memory cells is modified to decrease voltage threshold drift in the RESET state.

The present disclosure includes apparatuses, methods, and systems for increase of a sense current in memory. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to count a number of program operations performed on the memory cells of the memory during operation of the memory, and increase a magnitude of a current used to sense a data state of the memory cells of the memory upon the count of the number of program operations reaching a threshold count.

The present disclosure includes apparatuses and methods for programming memory cells using asymmetric current pulses. An embodiment includes a memory having a plurality of self-selecting memory cells, and circuitry configured to program a self-selecting memory cell of the memory by applying a first current pulse or a second current pulse to the self-selecting memory cell, wherein the first current pulse is applied for a longer amount of time than the second current pulse and the first current pulse has a lower amplitude than the second current pulse.

A device may include a first die having a first circuit and a second die having a second circuit. The die may be separated by a material layer. The material layer may include multiple through-silicon vias (TSVs) for electrically coupling the first die to the second die. A first TSV of the TSVs may electrically couple the first circuit to the second circuit and a second TSV of the TSVs may include a redundant TSV that electrically bypasses the first TSV to couple the first circuit to the second circuit if a fault is detected in the first TSV.

Aspects of the present disclosure provide a method for calibrating crossbar-based apparatuses. The method includes obtaining output data of a crossbar-based apparatus may include a plurality of cross-point devices with tunable conductance, where the output data of the crossbar-based apparatus represents computing results of at least one operation performed by the crossbar-based apparatus, and where the output data corresponding to a plurality of settings of a plurality of analog components of the crossbar-based apparatus. The method also includes obtaining, by a processing device, one or more calibration parameters based on the output data of the crossbar-based apparatus, where the one or more calibration parameters correspond to one or more errors associated with one or more of the analog components of the crossbar-based apparatus. The method further includes calibrating the crossbar-based apparatus using the one or more calibration parameters.

A memory circuit includes a plurality of memory cells, each memory cell including a resistive memory element and a selection transistor of the FDSOI type connected in series with the resistive memory element. The selection transistor includes a channel region, a buried insulating layer, a back gate separated from the channel region by the buried insulating layer. The memory circuit further includes a circuit for biasing the back gate of the selection transistors, the biasing circuit being configured to apply a forward back-bias to the selection transistor of at least one memory cell during a programming or initialisation operation of the at least one memory cell.

Circuit and method for controlling a resistive memory formed by resistive memory cells each provided with a resistive memory element associated in series with a selector, each cell implementing a coding referred to as “multi-level” coding and being programmed in a given programming state among k (with k>2) possible programming states, wherein during a read operation, a sequence of different read voltages are applied to the given cell, and at each applied read voltage it is detected whether the read current passing through said given cell consecutively to the application of said read voltage corresponds to a leakage current level of the selector when this selector is in an off state or to a current level when the selector is in an on state.

A storage circuit includes: the array of a memory cell MC including a variable-resistance element; a conversion circuit that converts the resistance value of each memory cell into the signal level of an electric signal; a reference signal generation circuit that generates a reference signal common to a plurality of columns; a correction circuit that corrects one of the signal level of the reference signal and the signal level of the electric signal for each column of the array of the memory cell; and an RW circuit that determines data stored in the memory cell belonging to a corresponding column by comparing one of the reference level and the signal level of the electric signal, corrected by the correction circuit, and the other of the reference level and the signal level of the electric signal.

A resistive memory device includes: conductive layers and interlayer insulating layers, which are alternatively stacked; a vertical hole vertically penetrating the conductive layers and the interlayer insulating layers; a gate insulating layer disposed over an inner wall of the vertical hole; a charge trap layer disposed over an inner wall of the gate insulating layer; a channel layer disposed over an inner wall of the charge trap layer; and a variable resistance layer disposed over an inner wall of the channel layer.