In a method for accessing memory cells, a first read operation is performed on a first memory cell to read a first data value from the first memory cell. During the first read operation, a first variable current source provides a first assessment current having a first current level to a first bitline coupled to the first memory cell. A second read operation is performed on the first memory cell to read a second data value from the first memory cell. During the second read operation, the first variable current source manipulates the first current level to provide a second current level to the first bitline. A difference between the first current level and the second current level is based on whether the first data value that was read during the first read operation was a first data state or a second data state.

According to one embodiment, a memory device includes a first wiring line, a second wiring line, a memory cell connected between the first and second wiring lines, including a resistance change memory element having first and second resistance states, and a two-terminal switching element connected in series to the resistance change memory element, and a voltage application circuit which applies a write voltage signal having a first polarity and setting a desired resistance state to the resistance change memory element, to the memory cell, and applies, after the write voltage signal is applied to the memory cell, a second polarity voltage signal having a magnitude that prevents the two-terminal switching element from being set to the on-state, to the memory cell.

An integrated circuit for a print component including a number of memory bits. The integrated circuit may include a selection circuit to select at least one memory bit of the number of memory bits and fire actuators of a fire pulse group. The integrated circuit may include a memory voltage regulator to provide a write voltage to the at least one memory bit of the number of memory bits.

Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

A method of forming a filament in a resistive random-access memory (RRAM) device includes applying a cell voltage across a resistive layer of the RRAM device, detecting an increase in a current through the resistive layer generated in response to the applied cell voltage, and in response to detecting the increase in the current, using a first switching device to reduce the current through the resistive layer.

An integrated circuit memory device having: a memory cell; and a voltage driver of depletion type connected to the memory cell. In a first polarity, the voltage driver is powered by a negative voltage relative to ground to drive a negative selection voltage or a first de-selection voltage; In a second polarity, the voltage driver is powered by a positive voltage relative to ground to drive a positive selection voltage or a second de-selection voltage. The voltage driver is configured to transition between the first polarity and the second polarity. During the transition, the voltage driver is configured to have a control voltage swing for outputting de-selection voltages smaller than a control voltage swing for output selection voltages.

A write method for a resistive memory including a storage array, a control circuit and an access circuit is provided. The control circuit receives an external command to activate the access circuit to access the storage array. The write method includes determining whether the external command is ready to perform a write operation for the storage array; generating a first operation voltage group to the access circuit when the external command does not perform the write operation for the storage array; reading a count value of a block that corresponds to a write address when the external command performs the write operation for the storage array, wherein the count value indicates the number of times that the block corresponding to the write address performs the write operation; and generating a second operation voltage group to the access circuit according to the count value of the block.

An illustrative embodiment disclosed herein is an apparatus including a non-volatile memory cell and multi-bit input circuitry that simultaneously receives a plurality of bits, receives a supply voltage, converts the plurality of bits and the supply voltage into a multiply voltage, and applies the multiply voltage to the non-volatile memory cell. The non-volatile memory cell may pass a memory cell current in response to the multiply voltage. A magnitude of the multiply voltage may represent a multiplier. The memory cell current may represent a product of the multiplier and a multiplicand stored in the non-volatile memory cell.

A read and write circuit of a three-dimensional phase-change memory including an operation control circuit and a read and write operation circuit connected to each other. The operation control circuit is configured to load a correct operation pulse onto the read and write operation circuit. A read and write unit in the read and write operation circuit is connected to a memory cell and is configured to load the correct operation pulse onto the memory cell corresponding to the three-dimensional phase-change memory and to mirror the correct operation pulse to a mirror current. A bandgap reference source and a hysteresis comparator are connected to a mirror circuit branch. A feedback chopper circuit loop is connected across the memory cell and the mirror circuit branch and is configured to monitor a current flowing through the memory cell in real time.

An array device and a writing method thereof are provided. A synapse array device includes: a crossbar array, in which a resistive memory element is connected to each intersection of a plurality of row lines and a plurality of column lines; a row select/drive circuit selecting a row line of the crossbar array and applying a pulse signal to the selected row line; a column select/drive circuit selecting a column line of the crossbar array and applying a pulse signal to the selected column line; and a writing part writing to the resistive memory element connected to the selected row line and the selected column line. A first write voltage with controlled pulse width is applied to the selected row line, and a second write voltage with controlled pulse width is applied to the selected column line to perform set writing of the resistive memory element.