A solid state storage includes a non-volatile memory and a controlling circuit. The non-volatile memory includes a first block. The controlling circuit is connected with the non-volatile memory. The controlling circuit includes a function storage circuit. The function storage circuit stores plural prediction functions. According to plural state parameters corresponding to the first block and a first prediction function of the plural prediction functions, the controlling circuit predicts a read voltage shift of the first block.

A charge pump apparatus including a first charge pump system, a second charge pump system, a switch transistor, and a voltage regulation circuit is provided. The first charge pump system converts a first supply voltage into a first boost voltage. The second charge pump system converts a second supply voltage into a second boost voltage. The switch transistor is coupled to the first charge pump system and the second charge pump system, and outputs an output voltage according to the second boost voltage. The switch transistor includes a control terminal receiving the second boost voltage, a first terminal receiving the first boost voltage, and a second terminal outputting the output voltage. The voltage regulation circuit controls the second charge pump system according to the output voltage to adjust the second boost voltage so that the output voltage approaches to a target output value.

According to one embodiment, a semiconductor memory device includes: a plurality of first insulating layers; a plurality of first interconnect layers stacked alternately with the first insulating layers; a plurality of second interconnect layers arranged adjacently to the first interconnect layers; and a separation region including a plurality of first portions provided between the first interconnect layers and the second interconnect layers, and a plurality of second portions protruding from an outer periphery of each of the first portions. The second portions are linked to each other. The first interconnect layers and the second interconnect layers are separated from each other by the first portions and the linked second portions.

The application relates to a data reading circuit of an embedded flash memory cell. The data reading circuit a switch circuit, a current clamp circuit, a current mirror circuit, a reference current source, a precharge circuit and a comparison circuit; the switch circuit includes a transmission gate, one end of the transmission gate is connected with a drain of the embedded flash memory cell, and the other end of the transmission gate is connected with a detection end of the current clamp circuit; a response end of the current clamp circuit is connected with a data node; the current mirror circuit is connected with the reference current source and the data node; an output end of the precharge circuit is connected with the data node; one input end of the comparison circuit is connected with the data node, and the other input end is connected with reference voltage.

Various embodiments of the present application are directed to an IC device and associated forming methods. In some embodiments, a memory region and a logic region are integrated in a substrate. A memory cell structure is disposed on the memory region. A plurality of logic devices disposed on a plurality of logic sub-regions of the logic region. A first logic device is disposed on a first upper surface of a first logic sub-region. A second logic device is disposed on a second upper surface of a second logic sub-region. A third logic device is disposed on a third upper surface of a third logic sub-region. Heights of the first, second, and third upper surfaces of the logic sub-regions monotonically decrease. By arranging logic devices on multiple recessed positions of the substrate, design flexibility is improved and devices with multiple operation voltages are better suited.

A programming method for a memory device is disclosed. The programming method comprises moving a plurality of first charge carriers at a shallow energy level to a channel in a substrate layer before a programming operation for a first word line, wherein the plurality of first charge carriers at the shallow energy level correspond to a memory cell to be programmed.

A non-volatile electronic memory device is integrated on a semiconductor and is of the Flash EEPROM type with a NAND architecture including at least one memory matrix divided into physical sectors, intended as smallest erasable units, and organized in rows or word lines and columns or bit lines of memory cells. At least one row or word line of a given physical sector is electrically connected to at least one row or word line of an adjacent physical sector to form a single logic sector being erasable, with the source terminals of the corresponding cells of the pair of connected rows referring to a same selection line of a source line.

A method of making a monolithic three dimensional NAND string which contains a semiconductor channel and a plurality of control gate electrodes, includes selectively forming a plurality of discrete charge storage regions using atomic layer deposition. The plurality of discrete charge storage regions includes at least one of a metal or an electrically conductive metal oxide.

In one embodiment, an apparatus comprises a storage device comprising a NAND flash memory array, the storage device to program, during a first programming pass, a plurality of cells of a first wordline of the NAND flash memory array to store a first page of data; initiate a read of the first page of data prior to completion of loading of a second page of data to be programmed during a second programming pass; and program, during the second programming pass, the plurality of cells of the first wordline of the NAND flash memory array to store the first page of data and the second page of data.

In some implementations, one or more semiconductor processing tools may form a first terminal of a semiconductor device by depositing a tunneling oxide layer on a first portion of a body of the semiconductor device, depositing a first volume of polysilicon-based material on the tunneling oxide layer, and depositing a first dielectric layer on an upper surface and a second dielectric layer on a side surface of the first volume of polysilicon-based material. The one or more semiconductor processing tools may form a second terminal of the semiconductor device by depositing a second volume of polysilicon-based material on a second portion of the body of the semiconductor device. A side surface of the second volume of polysilicon-based material is adjacent to the second dielectric layer.