G11C16/04

OBTAINING THRESHOLD VOLTAGE MEASUREMENTS FOR MEMORY CELLS BASED ON A USER READ MODE

Apparatuses and techniques are described for obtaining a threshold voltage distribution for a set of memory cells based on a user read mode. The user read mode can be based on various factors including a coding of a page and an increasing or decreasing order of the read voltages. The read process for the Vth distribution is made to mimic the read mode which is used when the memory device is in the hands of the end user. This results in a Vth distribution which reflects the user's experience to facilitate troubleshooting. In some cases, one or more dummy read operations are performed, where the read result is discarded, prior to a read operation which is used to build the Vth distribution.

STRING BASED ERASE INHIBIT
20230049605 · 2023-02-16 · ·

A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

MEMORY DEVICE THAT IS OPTIMIZED FOR LOW POWER OPERATION
20230052121 · 2023-02-16 · ·

A storage device that includes a non-volatile memory is provided. The non-volatile memory includes a control circuitry that is communicatively coupled to a memory block that includes memory cells arranged word lines. The control circuitry is configured to program the memory cells of a selected word line in a plurality of programming loops to store a single bit of data in each memory cell of the selected word line. The programming loops include programming operations and verify operations. The programming operations include applying a programming voltage to the selected word line, and the verify operations include applying a verify voltage to the selected word line. At least one programming loop of the plurality of programming loops further includes a pre-verify operation. The pre-verify operation includes applying a pre-read voltage to the selected word line. The pre-read voltage is less than the verify voltage.

MEMORY DEVICE AND METHOD OF OPERATING THE SAME
20230048790 · 2023-02-16 ·

The present technology relates to an electronic device. According to the present technology, a memory device having improved verify accuracy may include a memory block including memory cells, a read and write circuit including a plurality of page buffers, a current sensing circuit configured to perform a verify operation of comparing sensing voltages with a reference voltage, and a control logic configured to control the current sensing circuit to perform the verify operation. The control logic controls performing a first verify operation on each of page buffer groups having a same logical group number, and performing a second verify operation on each of page buffer groups having a same physical group number, and the current sensing circuit outputs a verify pass signal in response to both results of the first verify operation and the second verify operation satisfying a pass criterion.

CLOCK MODE DETERMINATION IN A MEMORY SYSTEM
20230046725 · 2023-02-16 ·

A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.

SEMICONDUCTOR STORAGE DEVICE
20230047685 · 2023-02-16 ·

A semiconductor storage device includes a memory cell array, a peripheral circuit configured to perform writing of data to the memory cell array and reading of data from the memory cell array, and a sampling circuit configured to execute a sampling process by which sampling data is collected from a predetermined node of the peripheral circuit, during a period in which the peripheral circuit performs the writing of data to the memory cell array or the reading of data from the memory cell array.

MEMORY CELL SENSING
20230046283 · 2023-02-16 · ·

Sensing devices might include a first voltage node configured to receive a first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, a p-type field-effect transistor (pFET) selectively connected to a data line, and a sense node selectively connected to the pFET. The pFET might be connected between the first voltage node and the data line, between the second voltage node and the data line, and between the first voltage node and the data line. Memories might have controllers configured to cause the memories to determine whether a memory cell has an intended threshold voltage using similar sensing devices.

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
20230051739 · 2023-02-16 ·

To provide a highly reliable memory device. A first insulator is formed over a substrate; a second insulator is formed over the first insulator; a third insulator is formed over the second insulator; an opening penetrating the first insulator, the second insulator, and the third insulator is formed; a fourth insulator is formed on the inner side of a side surface of the first insulator, a side surface of the second insulator, and a side surface of the third insulator, in the opening; an oxide semiconductor is formed on the inner side of the fourth insulator; the second insulator is removed; and a conductor is formed between the first insulator and the third insulator; and the fourth insulator is formed by performing, a plurality of times, a cycle including a first step of supplying a gas containing silicon and an oxidizing gas into a chamber where the substrate is placed, a second step of stopping the supply of the gas containing silicon into the chamber; and a third step of generating plasma containing the oxidizing gas in the chamber.

ANTIFUSE-TYPE ONE TIME PROGRAMMING MEMORY CELL AND CELL ARRAY STRUCTURE WITH SAME
20230049378 · 2023-02-16 ·

An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.

Calculating soft metrics depending on threshold voltages of memory cells in multiple neighbor word lines
20230052685 · 2023-02-16 ·

A memory controller includes an interface and a processor. The interface communicates with memory cells organized in multiple Word Lines (WLs). The processor is configured to read a Code Word (CW) of an Error Correction Code (ECC) from a group of multiple memory cells belonging to a target WL, to calculate for a given memory cell (i) a first soft metric, depending on a first threshold voltage of a first neighbor memory cell in a first WL neighboring the target WL, and (ii) a second soft metric, depending on a second threshold voltage of a second neighbor memory cell in a second WL neighboring the target WL, to calculate a combined soft metric based on both the first and second soft metrics and assign the combined soft metric to the given memory cell, and to decode the CW based on the combined soft metric, to produce a decoded CW.