A memory device has a vertical structure in which a row decoder, a page buffer, and a peripheral circuit are disposed under a memory cell array. The row decoder and the page buffer may be asymmetrically disposed. The peripheral circuit is disposed in an area where the row decoder and the page buffer are not disposed. The row decoder and the page buffer may be symmetrically disposed with respect to an interface of planes. The peripheral circuit may be disposed in an area including a part of the interface of the planes.

Disclosed is a data storage device including a controller and a multi-stack chip package, and a method of operating a data storage device. The multi-stack chip package includes a first semiconductor chip arranged on a package substrate, a second semiconductor chip arranged on the first semiconductor chip, and a third semiconductor chip is arranged between the first and second semiconductor chips. The controller can control the first to third semiconductor chips by using a feature parameter measured from each semiconductor chip and a target value that may be originally designed by a memory vendor.

A method of fabricating a multi-level memory cell that includes the steps of forming a shallow trench isolation (STI) in a substrate, performing clean and preclean process such that top surfaces of the STI and substrate are substantially leveled, forming a tunnel dielectric using a radical oxidation process, forming upper and lower silicon oxynitride layers in which an amount of electric charge trapped represents N×analog values stored in the multi-level memory cell, N is a natural number greater than 2, forming a blocking dielectric and patterning to form a memory stack, and forming a lightly-doped drain extension (LDD) adjacent to the memory stack by angled implant such that the LDD extends at least partly under the memory stack.

A non-volatile memory device includes a memory cell which stores one of first data and second data, and includes a first sub-memory cell connected to a first word line and a first bit line, and a second sub-memory cell connected to a second word line and a second bit line, a source line shared by the first sub-memory cell and the second sub-memory cell, and a sense amplifier connected to the first bit line and the second bit line which reads data stored in the memory cell. The sense amplifier receives a first current from the first bit line, receives a second current from the second bit line, and reads data stored in the memory cell by comparing magnitudes of the first current and the second current. The first sub-memory cell is programmed, and the second sub-memory cell is erased, in response to the memory cell storing the first data.

A memory controller includes, in one embodiment, a memory interface and a controller circuit. The memory interface is configured to interface with a memory interface configured to interface with a memory having a plurality of memory blocks. Each memory block has a plurality of strings. The controller circuit is configured to perform a string defect leakage check on one of the memory blocks during a first programming operation of the one memory block, determine whether the one memory block has one or more string to string shorts based on the string defect leakage check, and resolve the string to string shorts in response to determining that the one of the memory blocks has the string to string shorts.

A method for erasing non-volatile memory including applying a first voltage pulse to a non-volatile memory cell to perform a first erase operation of the non-volatile memory cell and determining that a threshold voltage of the non-volatile memory cell is greater than a test voltage. The method further comprising updating a dedicated memory location with a value; and checking the non-volatile memory cell to determine whether the threshold voltage of the non-volatile memory cell is less than an erase-verify voltage to verify that the first erase operation has been performed successfully.

A decoding method for a rewritable non-volatile memory module is provided according to an exemplary embodiment of the disclosure. The method includes: obtaining usage state information of first memory cells; reading second memory cells by a first read voltage level to obtain at least one first bit and reading the second memory cells by a second read voltage level to obtain at least one second bit according to the usage state information, wherein the first bit corresponds to a storage state of a first part of memory cells among the second memory cells, the second bit corresponds to a storage state of a second part of memory cell among the second memory cells, and the first read voltage level is different from the second read voltage level; and decoding third bits including the first bit and the second bit. Therefore, a decoding efficiency can be improved.

A buried source semiconductor layer and p-doped semiconductor material portions are formed over a first portion of a substrate. The buried source semiconductor layer is an n-doped semiconductor material, and the p-doped semiconductor material portions are embedded within the buried source semiconductor layer. An alternating stack of insulating layers and spacer material layers is formed over the substrate. Memory stack structures are formed through the alternating stack. The spacer material layers are formed as, or are replaced with, electrically conductive layers. The buried source semiconductor layer may be formed prior to, or after, formation of the alternating stack. The buried source semiconductor layer underlies the alternating stack and overlies the first portion of the substrate, and contacts at least one surface of the vertical semiconductor channels. The p-doped semiconductor material portions contact at least one surface of a respective subset of the vertical semiconductor channels.

Apparatuses, systems, methods, and computer program products are disclosed for state-dependent read compensation. A set of non-volatile storage cells comprising a plurality of word lines. A controller is configured to perform a read operation on one or more word lines adjacent to a target word line. A controller is configured to determine a read setting for application to a target word line based on a result of a read operation on one or more word lines adjacent to the target word line. A controller is configured to perform a read operation on a target word line using a determined read setting.

Systems and methods for reducing the area and improving the performance of a non-volatile memory array are described. The non-volatile memory array may comprise a 3D NAND memory array that includes vertical NAND strings that are arranged orthogonal to a substrate. A vertical NAND string may include floating gate memory cell transistors or charge trap memory cell transistors. Sensing circuitry for sensing the programmed data states of memory cell transistors within the vertical NAND strings may be positioned underneath the 3D NAND memory array and connections from bit lines positioned above the 3D NAND memory array may be made using vertical connections extending though the 3D NAND memory array or through memory breaks within the 3D NAND memory array.