A semiconductor memory device includes a precharge block, a select block, a peripheral circuit, and control logic. The precharge block is connected to bit lines and includes memory cells in an erase state. The select block shares the bit lines with the precharge block and includes memory cells in a program state. The peripheral circuit performs erase operation on the select block. The control logic controls the peripheral circuit to turn on a first circuit connected to the precharge block and apply first voltage to global lines connected to the first circuit when erase voltage is applied to a source line commonly connected to the precharge block and the select block. The memory cells of the precharge block are turned on by the first voltage applied from the global lines, and the erase voltage applied to the source line is transferred to the bit lines through the precharge block.

A semiconductor memory device includes a precharge block, a select block, a peripheral circuit, and control logic. The precharge block is connected to bit lines and includes memory cells in an erase state. The select block shares the bit lines with the precharge block and includes memory cells in a program state. The peripheral circuit performs erase operation on the select block. The control logic controls the peripheral circuit to turn on a first circuit connected to the precharge block and apply first voltage to global lines connected to the first circuit when erase voltage is applied to a source line commonly connected to the precharge block and the select block. The memory cells of the precharge block are turned on by the first voltage applied from the global lines, and the erase voltage applied to the source line is transferred to the bit lines through the precharge block.

Apparatuses and methods including memory commands for semiconductor memories are described. A controller provides a memory system with memory commands to access memory. The commands are decoded to provide internal signals and commands for performing operations, such as operations to access the memory array. The memory commands provided for accessing memory may include timing command and access commands. Examples of access commands include a read command and a write command. Timing commands may be used to control the timing of various operations, for example, for a corresponding access command. The timing commands may include opcodes that set various modes of operation during an associated access operation for an access command.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

According to the one embodiment, a memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes: first and second memory cells stacked above a substrate; a first word line coupled to the first and second memory cells; a first bit line coupled to the first memory cell; and a second bit line coupled to the second memory cell. A first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell. A first read voltage is applied to the first word line during a first period for executing the first read operation, and a second read voltage is applied to the first word line during a second period for executing the second read operation.

According to the one embodiment, a memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes: first and second memory cells stacked above a substrate; a first word line coupled to the first and second memory cells; a first bit line coupled to the first memory cell; and a second bit line coupled to the second memory cell. A first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell. A first read voltage is applied to the first word line during a first period for executing the first read operation, and a second read voltage is applied to the first word line during a second period for executing the second read operation.

Described is a semiconductor memory device and methods of manufacture. The semiconductor memory device comprises a memory array comprising at least one select-gate-for-drain (SGD) transistor and at least one memory transistor, the memory array having at least one strapping region and at least one strapping contact, the strapping contact connecting a select-gate-for-drain (SGD) transistor to a strapping line.