A system can validate multiple nonvolatile random-access memory (NVRAM) devices in parallel. The system can concurrently write a first data to a first volatile memory of a first NVRAM device and a second NVRAM device. The system can modify a first electrical power source that provides an electrical power output that is received by the first NVRAM device and is received by the second NVRAM device to modify a voltage of the electrical power from a first value to a second value to initiate the first NVRAM device and the second NVRAM device to respectively perform a vault. The system can reset the first electrical power source, causing the first NVRAM device and the second NVRAM device to reset. The system can verify whether the first NVRAM device and the second NVRAM device respectively store the first data in volatile memory subsequent to performing the resetting.

According to one embodiment, a memory system includes: a controller configured to execute an error correction process on first data read from a first area at a first address of a memory device and determine a read level used for reading data at the first address according to a result of the correction process. The controller executes the correction process on first frame data of the first data. When the correction process on the first frame data has failed, the controller executes the correction process on second frame data of the first data. When the correction process on the second frame data has succeeded, the controller determines the read level based on a result of comparison between the second frame data and a result of the correction process on the second frame data.

The present application provides a memory test circuit and a device wafer including the memory test circuit. The memory test circuit is coupled to a memory array having intersecting first and second signal lines, and includes a fuse element and a transistor. The fuse element has a first terminal coupled to a first group of the first signal lines and a test voltage, and has a second terminal coupled to second and third groups of the first signal lines. The transistor has a source/drain terminal coupled to the second terminal of the fuse element and another source/drain terminal coupled to a reference voltage. The first group of the first signal lines are selectively coupled to the test voltage when the transistor is turned on, and all of the first signal lines are coupled to the test voltage when the transistor is kept off.

The present disclosure provides a memory controller including a state detector detecting whether the memory device is in an idle state, a program controller selecting neighboring strings that are adjacent to a string that is coupled to a memory cell, among the memory cells, on which a program operation or a read operation is performed based on detection information that indicates a state of the memory device, selecting monitoring memory cells that are coupled to at least one word line, the memory cells being a part of the neighboring strings, and controlling the memory device to perform a plurality of loops to program the monitoring memory cells, and a bad block selector selecting a memory block with the monitoring memory cells as a bad block based on a rate of increase of a threshold voltage distribution of the monitoring memory cells.

The present disclosure relates to integrated circuits, and more particularly, to a method for identifying unprogrammed bits for one-time-programmable memory (OTPM) and a corresponding structure. In particular, the present disclosure relates to a structure including: a read circuit configured to perform at least one read operation at an address for a twin-cell one-time-programmable-memory (OTPM); and a comparison circuit configured to identify whether at least one bit of the address for the twin-cell OTPM has been programmed based on the at least one read operation.

Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A first data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. In response to determining the first indicator of data integrity is greater than a current maximum value, the current maximum value is set to the first indicator of data integrity. In response to determining the current maximum value satisfies a threshold value, a size of a subsequent set of read operations is set to a second number, which less than the first number.

A read technique for both SLC (single level cell) and MLC (multi-level cell) cross-point memory can mitigate drift-related errors with minimal or no drift tracking. In one example, a read at a higher magnitude voltage is applied first, which causes the drift for cells in a lower threshold voltage state to be reset. In one example, the read at the first voltage can be a full float read to minimize disturb. A second read can then be performed at a lower voltage without the need to adjust the read voltage due to drift.

The present disclosure provides a circuit for detecting leakage between word lines in a memory device. The circuit includes a first and a second coupling capacitor. A first terminals of the first and second coupling capacitors are connected to a first word line and a second word line, respectively. The first terminals of the first and second coupling capacitors are also connected to a first and a second voltage supply, respectively. The circuit further includes a comparator, wherein a first input of the comparator is connected to a second terminal of the first coupling capacitor and a second input of the comparator is connected to a second terminal of the second coupling capacitor. The comparator is configured to send alarm signal when a differential voltage between the first input and the second input of the comparator is larger than a hysteresis level of the comparator.

A memory device includes a memory cell array including memory cells connected to word lines and bit lines. Each of the memory cells includes a switch element and a memory element, and has a first state or a second state in which a threshold voltage is within a first voltage range or a second voltage range, lower than the first voltage range. A memory controller is configured to execute a first read operation for the memory cells using a first read voltage, higher than a median value of the first voltage range, program first defect memory cells turned off during the first read operation to the first state, execute a second read operation for the memory cells using a second read voltage, lower than a median value of the second voltage range, and execute a repair operation for second defect memory cells turned on during the second read operation.

There is provided a semiconductor apparatus including a memory operation terminal group that includes a plurality of memory operation terminals; an inspection terminal group that includes a plurality of inspection terminals; a constant voltage terminal group that includes a plurality of constant voltage terminals; a drive terminal group that includes a plurality of drive terminals, the inspection terminal group, and the constant voltage terminal group, and of which voltage values change in accordance with an operation of a CPU; and a terminal mounting surface, in which at the terminal mounting surface, the inspection terminal group and the constant voltage terminal group are located to separate the memory operation terminal group and the drive terminal group, and the memory operation terminal group is located not to be adjacent to a terminal which is not included in the inspection terminal group and the constant voltage terminal group.