An apparatus includes a nonvolatile semiconductor memory device storing identification information and first setting information on an output signal, a memory holding identification information of nonvolatile semiconductor memory devices, the identification information including the identification information of the nonvolatile semiconductor memory device, and setting information on an output signal associated with the identification information of the nonvolatile semiconductor memory devices, the setting information including at least second setting information on the output signal, and a processor acquiring the identification information of the nonvolatile semiconductor memory.

In certain aspects, a circuit for ZQ resistor calibration can include a first input configured to receive a first default configuration. The circuit can also include a second input configured to receive a first calibration value based on a first comparison. The circuit can further include a first output configured to provide a first resistor code for a first resistor category. The circuit can additionally include a second output configured to provide a second resistor code for a second resistor category different from the first resistor category. The circuit can also include a first logic circuit configured to receive a signal from the first input and a signal from the second input, and provide a signal to the first output. The signal to the first output can include the first resistor code. The first resistor code can be different from the second resistor code.

A method includes measuring a linearity of a first pull-up circuit, a second pull-up circuit, a third pull-up circuit, a first pull-down circuit, a second pull-down circuit and a third pull-down circuit using an initial pull-up code and an initial pull-down code, each of the first pull-up circuit, the second pull-up circuit and the third pull-up circuit having a respective resistance value determined based on a respective pull-up code, and each of the first pull-down circuit, the second pull-down circuit and the third pull-down circuit having a respective resistance value determined based on a respective pull-down code, and determining a calibration setting indicator based on the measurement result, the calibration setting indicator indicating a calibration method of a transmission driver including the first pull-up circuit, the second pull-up circuit, the third pull-up circuit, the first pull-down circuit, the second pull-down circuit and the third pull-down circuit.

A method for ZQ calibration for a data transmission driving circuit of each memory die in a memory chip package in which memory dies are stacked, includes generating a reference current through a reference resistor connected between a power terminal supplying a power voltage of the data transmission driving circuit and a ground terminal and a first transistor that is diode-connected; supplying first currents corresponding to the reference currents to a pull-up driver of each memory die; performing ZQ calibration of a pull-up driver of a corresponding memory die by comparing a first voltage formed by each first current with a reference voltage formed by the reference current in each of the plurality of memory dies; and performing ZQ calibration of a pull-down driver of the corresponding memory die based on an output impedance of the ZQ calibrated pull-up driver in each of the memory dies.

A data storage system includes a plurality of memory dies and interface circuitry, including a receiver configured to receive pulses of a read clock signal; an I/O contact pad coupled to the receiver via a signal path of an interface channel; and on-die-termination (ODT) circuitry coupled to the I/O contact pad and the receiver. The ODT circuitry includes a plurality of resistor pairs, each including a pull-up resistor selectively coupled to the signal path via a first switch, and a pull-down resistor selectively coupled to the signal path via a second switch; and ODT control circuitry configured to enable ODT at the interface circuitry by causing each of the switches to be closed during a first stage of the read operation, and disable ODT at the interface circuitry by causing each of the switches to be open during a final stage of the read operation.

A memory device includes a first on-die termination circuit, a second on-die termination circuit, a voltage generator, and a code generator. The first on-die termination circuit may correspond to a data input buffer. The second on-die termination circuit may correspond to a command/address buffer. The voltage generator may generate a reference voltage. The code generator may generate a resistance calibration code of a selected one of the on-die termination circuits in response to the reference voltage. The reference calibration code may calibrate a resistance value of the selected on-die termination circuit.

A data retention reliability screen of integrated circuits including ferroelectric random access memory (FRAM) arrays. Sampled groups of cells in the FRAM array are tested at various reference voltage levels, after programming to a high polarization capacitance data state and a relaxation time at an elevated temperature. Fail bit counts of the sample groups at the various reference voltage levels are used to derive a test reference voltage, against which all of the FRAM cells in the integrated circuit are then tested after preconditioning (i.e., programming) and another relaxation interval at the elevated temperature, to determine those cells in the integrated circuit that are vulnerable to long-term data retention failure.

A system and method for use in dynamic random-access memory (DRAM) comprising entering into a self-refresh mode of operation, exiting the self-refresh mode of operation in response to commands from a self-refresh state machine memory operation (MOP) array, and updating a device state of the DRAM for a target power management state in response to commands from the MOP array.

A memory apparatus may include a plurality of ranks commonly coupled to an input/output (I/O) terminal. Non-target ranks other than a target rank among the plurality of ranks may be configured to perform an on die termination operation based on a read operation of the target rank.

A device includes a power supply line, an output terminal, a circuit configured to perform a logic operation on a first signal and a second signal to produce a third signal, first, second and third transistors. The first transistor is coupled between the power supply line and the output terminal and includes a control gate supplied with the third signal. The second and third transistors are coupled in series between the power supply line and the output terminal. The second transistor includes a control gate supplied with the first signal and the third transistor includes a control gate supplied with a fourth signal that is different from each of the first, second and third signals.