Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.

A semiconductor device capable of performing product-sum operation with low power consumption. The semiconductor device includes first and second logic circuits, first to fourth transistors, and first and second holding units. A low power supply potential input terminal of the first logic circuit is electrically connected to the first and third transistors. A low power supply potential input terminal of the second logic circuit is electrically connected to the second and fourth transistors. The potentials of second gates of the first and fourth transistors are held in the first holding unit as potentials corresponding to first data. The potentials of second gates of the second and third transistors are held in the second holding unit. The on/off states of the first to fourth transistors are determined by second data. A difference in signal input/output time between the first and second logic circuits depends on the first data and the second data.

Automatic memory overclocking, including: increasing a memory frequency setting for a memory module until a memory stability test fails; determining an overclocked memory frequency setting including a highest memory frequency setting passing the memory stability test; and generating a profile including the overclocked memory frequency setting.

An apparatus includes a static random-access memory and circuitry configured to initiate a corrective action associated with the static random-access memory. The corrective action may be initiated based on a number of static random-access memory cells that have a particular state responsive to a power-up of the static random-access memory.

Methods, systems, and devices for back-bias optimization are described. An apparatus, such as an electronic apparatus, may include a first substrate region and a second substrate region. The apparatus may also include a voltage generator that is disposed on the first substrate region and that includes an output terminal coupled with a conductive path. The apparatus may also include a set of clamp circuits disposed on the second substrate region. The set of clamp circuits may be configured selectively couple the conductive path with a voltage supply.

A semiconductor storage device includes a memory cell and a control circuit configured to, upon receipt of a command, acquire a first temperature measured by a temperature sensor, and perform an operation corresponding to the command using a parameter corrected based on temperature. When the first temperature is within a predetermined range with respect to a second temperature measured before the command is received, the parameter is corrected using the second temperature. When the first temperature is outside the predetermined range, the parameter is corrected using the first temperature.

A system comprising a memory device and a processing device, operatively coupled to the memory device. The processing device is to perform operations including initializing a block family associated with the memory device and measuring an opening temperature of the memory device at initialization of the block family. Responsive to programming a page residing on the memory device, the operations further include associating the page with the block family. The operations further include determining a temperature metric value by integrating, over time, an absolute temperature difference between the opening temperature and an immediate temperature of the memory device. The operations further include closing the block family in response to the temperature metric value being greater than or equal to a specified threshold temperature value.

Disclosed herein is an apparatus that includes a first semiconductor chip, and a first TSV penetrating the first semiconductor chip. The first semiconductor chip includes a first resistor coupled between a first power supply and a first node, a switch circuit coupled between the first node and the first TSV, a pad electrode operatively coupled to the first node, and a constant current source operatively coupled to either one of the first node and the pad electrode.

A refresh time detection circuit and a semiconductor device including the same may be provided. The refresh time detection circuit may include a code generator configured to generate a code signal for detecting a refresh time. The refresh time detection circuit may include a latch circuit configured to generate a latch signal by latching the code signal according to a fail signal, and generate a pre-code signal and a post-code signal by latching each latch signal according to a pre-enable signal and a post-enable signal. The refresh time detection circuit may include a subtractor configured to output a refresh detection signal by performing subtraction between the pre-code signal and the post-code signal. The refresh time detection circuit may include a comparator configured to generate a detection signal by comparing the refresh detection signal with an offset signal based on the post-enable signal.

A method for trimming analog temperature sensors. First, raise a temperature of a temperature sensor to a highest temperature of a qualification temperature range. Then, trim the temperature sensor such that a high temperature code generated by the temperature sensor represents an actual temperature reported by the temperature sensor at the highest temperature. Next, lower the temperature of the temperature sensor to a lowest temperature of the qualification temperature range. Determine a slope error between the high temperature code and a low temperature code generated by the temperature sensor at the lowest temperature. Finally, determine a correction function that compensates for the slope error of measured temperature codes generated by the temperature sensor for temperatures across the qualification temperature range.