An integrated circuit includes a primary memory array with cells switchable between first and second states. The circuit also includes sacrificial memory cells; each fabricated to be switchable between the first and second states and associated with at least one row of the primary array. A controller is configured to detect a write operation to a row of the primary array, stress a sacrificial cell associated with the row and detect a failure of the associated sacrificial cell. The sacrificial cells are fabricated to have lower write-cycle endurance than cells of the primary array or are subjected to more stress. Failure of a row of the primary array is predicted based, at least in part, on a detected failure of the associated sacrificial cell.

An armor piece may include a tested material. The armor piece also may include a plurality of electrical contacts distributed about and electrically connected to the tested material. The armor piece further may include a non-volatile memory (NVM) device. The NVM device may be hardened against exposure to x-ray radiation. The NVM device may be configured to store control voltages associated with respective electrical contacts of the plurality of electrical contacts.

Glitch detection in microelectronic devices, and related methods, devices, and systems, are described herein. A device may detect and compare a number of pulses of a signal to a timing aperture to determine if any of the number of pulses is a glitch. The timing aperture, which may be based on a timing signal and/or one or more pulse width thresholds, may define an acceptable pulse versus a problematic glitch.

A memory device includes a plurality of memory dies, each memory die of the plurality of memory dies comprising a memory array and a power management component, operatively coupled with the memory array. The power management component sends a test value to one or more other power management components on one or more other memory dies of the plurality of memory dies and receives one or more other test values from the one or more other power management components. The power management component compares the test value and the one or more other test values to a set of expected values, and responsive to the test value and the one or more other test values matching the set of expected values, determines that signal connections between the power management component and the one or more other power management components are functional.

A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.

The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.

Various embodiments enable age tracking of one or more physical memory locations (e.g., physical blocks) of a memory die, which can be from part of a memory device. In particular, various embodiments provide age tracking of one or more physical memory locations of a memory die (e.g., memory integrated circuit (IC)) using one or more aging bins on the memory die, where each aging bin is associated with a different set of physical memory locations of the memory die. By use of an aging bin for a set of physical memory locations, various embodiments can enable a processing device that interacts with a memory die, after the memory die has been subjected to one or more reflow soldering processes, to determine how much the set of physical memory locations have aged after the one or more reflow soldering processes.

A method of screening complementary metal-oxide-semiconductor CMOS integrated circuits, such as integrated circuits including CMOS static random access memory (SRAM) cells, for transistors susceptible to transistor characteristic shifts over operating time. For the example of SRAM cells formed of cross-coupled CMOS inverters, separate ground voltage levels can be applied to the source nodes of the driver transistors, or separate power supply voltage levels can be applied to the source nodes of the load transistors (or both). Asymmetric bias voltages applied to the transistors in this manner will reduce the transistor drive current, and can thus mimic the effects of bias temperature instability (BTI). Cells that are vulnerable to threshold voltage shift over time can thus be identified.

Provided are an operating method of a host device, an operating method of a memory device, and a memory system. The operating method of a host device includes transmitting a request command for performing an eye-opening monitor (EOM) operation to a memory device, transmitting a parameter for performing the EOM operation to the memory device, transmitting pattern data for performing the EOM operation to the memory device, and receiving a first response signal including a result of the EOM operation performed based on the parameter and the pattern data from the memory device.

Various implementations described herein refer to an integrated circuit having a first memory structure and a second memory structure. The first memory structure is disposed in a first area of the integrated circuit, and the first memory structure has first memory cells with first transistors. The second memory structure is disposed in a second area of the integrated circuit that is different than the first area, and the second memory structure has second memory cells with second transistors that are separate from the first transistors. The second transistors of the second memory cells are arranged to provide an output oscillating frequency for detecting variation of performance of the first transistors of the first memory cells.