A decoding method, a memory storage device and a memory control circuit unit are provided. The decoding method includes: reading memory cells based on a default hard-decision voltage level and decoding the obtained hard-bit information; if the decoding fails, reading the memory cells based on default soft-decision voltage levels and then decoding the obtained soft-bit information; if the decoding still fails, reading the memory cells based on first test voltage levels to obtain first soft-bit information and reading the memory cells based on second test voltage levels to obtain second soft-bit information; obtaining a first estimating parameter and a second estimating parameter according to the first soft-bit information and the second soft-bit information, respectively; and updating the default hard-decision voltage level according to the first estimating parameter and the second estimating parameter. As a result, a decoding efficiency can be improved.

A voltage generation circuit includes a plurality of rectification circuits configured to be selectively activated depending on a plurality of first control signals, and to generate an internal voltage according to respective reference voltages capable of being independently trimmed depending on a plurality of second control signals; a detection circuit configured to generate a detection signal by comparing a pre-detection signal, generated in each of the plurality of rectification circuits, and a reference signal; and a storage circuit configured to store a pre-select signal provided from an external system, and to output a stored signal to each of the plurality of rectification circuits as the plurality of second control signals.

A memory device to estimate a bit error count of data retrievable from a group of memory cells. For example, the memory device has a group of memory cells programmed to store a predetermined number of bits per memory cells to be read at a plurality of first voltages. The memory device determines a plurality of calibrated read voltages corresponding to the plurality of first voltages respectively, based on first signal and noise characteristics of the group of memory cells. The first signal and noise characteristics are used to compute second signal and noise characteristics of the group of memory cells for the calibrated read voltages. The second signal and noise characteristics are used in an empirical formula to compute an estimate of the bit error count of data retrievable from the group of memory cells using the calibrated read voltages.

According to one embodiment, a method of controlling a memory device includes supplying a second potential having a first value to a second electrode and simultaneously, or thereafter, supplying a third potential to a third electrode, and thereafter stopping supply of the third potential such that the potential of the third electrode decays while reducing the potential of the second electrode, and thereafter supplying a first potential to the first electrode.

According to an embodiment, a semiconductor device includes a transmission circuit including first and second transistors coupled in series between a first voltage terminal and a second voltage terminal, and a first common node coupled between the first and second transistors and coupled to a through line, the transmission circuit outputting a signal transferred from an internal circuit to the first common node according to an output control signal; a reception circuit including third and fourth transistors coupled in series between the first voltage terminal and the second voltage terminal, and a second common node coupled between the third and fourth transistors and coupled to the internal circuit, the reception circuit transferring a signal transferred through the through line to the internal circuit according to a first input control signal; and a deterioration acceleration circuit for applying stress to the first and third transistors according to a test signal.

Methods, systems, and devices for back-bias optimization are described. An apparatus, such as an electronic apparatus, may include a first substrate region and a second substrate region. The apparatus may also include a voltage generator that is disposed on the first substrate region and that includes an output terminal coupled with a conductive path. The apparatus may also include a set of clamp circuits disposed on the second substrate region. The set of clamp circuits may be configured selectively couple the conductive path with a voltage supply.

A semiconductor memory device includes memory cells coupled to a word line; and a peripheral circuit configured to read first to kth page data from the memory cells by sequentially applying first to kth test voltages to the word line, where k is a natural number greater than 3, wherein the peripheral circuit is configured to gradually reduce times during which the first to kth test voltages are applied to the word line.

A nonvolatile memory system, a nonvolatile memory controller and a method for reducing latency of a memory controller are disclosed. The nonvolatile memory controller includes a storage module configured to store data indicating threshold voltage shift read parameters and corresponding index values. The nonvolatile memory controller includes a status circuit configured to determine at least one usage characteristic of a nonvolatile memory device, and a read circuit configured to determine whether a usage characteristic meets a usage characteristic threshold. When a usage characteristic is determined to meet the usage characteristic threshold, the read circuit is configured to perform all subsequent reads of the nonvolatile memory device using a threshold voltage shift read instruction identified using one or more of the threshold voltage shift read parameters.

A memory device comprises a memory array; a word line driver circuit including a charge pump circuit configured to generate a program voltage target to be applied to a word line to program a memory cell of the memory array, and a control loop to activate the charge pump circuit using a control signal according to a comparison of a pump circuit output voltage to a specified duty cycle after the charge pump circuit output reaches the program voltage target, and provides an indication of current generated by the charge pump circuit according to the duty cycle; and logic circuitry that generates a fault indication when the current generated by the charge pump circuit is greater than a specified threshold current.

A memory device includes a first memory die of a plurality of memory dies, the first memory die comprising a first memory array and a first power management component, wherein the first power management component is configured to send a first test value to one or more other power management components on one or more other memory dies of the plurality of memory dies during a first power management cycle of a first power management token loop. The memory device further includes a second memory die of the plurality of memory dies, the second memory die comprising a second memory array and a second power management component, wherein the second power management component is configured to receive the first test value from the first power management component during the first power management cycle of the first power management token loop and send a second test value to the one or more other power management components on the one or more other memory dies of the plurality of memory dies during a second power management cycle of a second power management token loop. At least one of the first power management component or the second power management component is configured to compare the first test value and the second test value to a set of expected values to determine whether signal connections between the first power management component and the second power management component are functional.