A memory chip for dynamic approximate storage includes an array of memory cells associated with at least two regions. The chip further includes at least one threshold register for storing values for thresholds for memory cells corresponding to each of the at least two regions; and control logic to programmatically adjust the values for the thresholds for the memory cells. A method of controlling a storage device for dynamic approximate storage includes modifying at least one value stored in a threshold register and associated with at least one cell in a region of a memory comprising at least two regions to apply a biasing for the at least one cell, wherein the biasing adjusts ranges for values in a cell.

A program method of a nonvolatile memory device including a plurality of memory cells, each storing at least two bits of data, includes performing a first program operation based on a plurality of program voltages having a first pulse width to program first page data into selected memory cells connected to a selected word line among the plurality of memory cells; and performing a second program operation based on a plurality of program voltages having a second pulse width different from the first pulse width to program second page data into the selected memory cells in which the first page data is programmed.

Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

A memory including at least one line to which memory cells are coupled. A control circuit is configured to emit an end-of-operation signal at the end of the execution of an operation on at least one memory cell, and a glitch detection circuit coupled to the memory line is configured to supply a glitch detection signal when a falling edge of the amplitude of a voltage signal appears on the memory line in the absence of the end-of-operation signal.

A syndrome weight of failed decoding attempts is used to select parameters for future read retry operations. The following exemplary steps are performed until a decoding success or a predefined limited number of readings is reached: (i) reading a codeword using different read threshold voltages; (ii) mapping the readings to a corresponding likelihood value using a likelihood value assignment; and (iii) recording a syndrome weight for failed decoding attempts of the readings using the different read threshold voltages. Once the predefined limit is reached, the following exemplary steps are performed: (i) mapping the readings to a corresponding likelihood value using different likelihood value assignments, and (ii) recording a syndrome weight for failed decoding attempts of the readings using the different likelihood value assignments; and using a given read threshold voltage and/or a likelihood value assignment associated with a substantially minimum syndrome weight as an initial read threshold voltage and/or a higher priority read threshold voltage for subsequent read retry operations.

A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.

Technology is disclosed for detecting latent defects in non-volatile storage systems. Prior to writing data, a stress voltage is applied to SGS transistors in a 3D memory structure. After applying the stress voltage, the Vt of the SGS transistors are tested to determine whether they meet a criterion. The criterion may be whether a Vt distribution of the SGS transistors falls within an allowed range. If the criterion is not met, then a sub-block mode may be enabled. In the sub-block mode, data is not written to memory cells in a sub-block that contains SGS transistors whose Vt does not meet the criterion. Hence, the possibility of data loss due to defective SGS transistors is avoided. However, in the sub-block mode, data is written to memory cells in a sub-block that does not contain SGS transistors whose Vt does not meet the criterion. Hence, data capacity is preserved.

A storage system includes a controller part, a data storage part, and a transfer path of a signal that couples these parts. A driver included in the controller part transmits the signal including write data on the basis of a configured parameter, a receiver included in the data storage part receives the signal, and the write data included in the signal is written into a first storage area. The controller part reads the write data from the first storage area, determines whether or not a bit error exists in the write data, changes the parameter when the bit error exists to repeat similar determination and find an appropriate parameter at which the bit error no longer exists.

A memory array arranged as a plurality of memory cells. The memory cells are configured to operate at a determined voltage. A memory management circuitry coupled to the plurality of memory cells tags a first set of the plurality of memory cells as low-voltage cells and tags a second set of the plurality of memory cells as high-voltage cells. A power source provides a low voltage to the first set of memory cells and provides a high voltage to the second set of memory cells based on the tags.

A memory device to determine a voltage optimized to read a group of memory cells. In response to a command, the memory device reads the group of memory cells at a plurality of test voltages to determine a set of signal and noise characteristics of the group of memory cells. The memory device determines or recognizes a shape of a distribution of the signal and noise characteristics over the plurality of test voltages. Based on the shape, the memory device selects an operation in determining an optimized read voltage of the group of memory cells.