The disclosure is directed to a memory device including a controller configured for initiating a program operation for a first column of memory cells which belongs to a group of memory cells; setting a verify condition which comprises a leakage current threshold during a leakage current verifying operation; performing, via a leakage current verifying circuit, a leakage current verifying operation for the first column of the memory cells by applying a negative voltage sweep to each of first remaining M1 unselected WLs of the M WLs until finding a first negative voltage resulting in the first column of the memory cells having passed leakage current threshold; and applying the program operation for the first column of the memory cells by applying the first negative voltage to each of the first remaining M1 unselected WLs of the M WLs and a positive bit line voltage for the N BLs.

A semiconductor memory device includes a switching controller, a voltage generator and control logic. The switching controller is connected to a local word line. The voltage generator, connected to the switching controller, is configured to generate an operating voltage according to an input clock signal and transfer the operating voltage to the switching controller. The control logic is configured to control operations of the voltage generator and the switching controller. The control logic is configured to detect an amount of leakage current of the local word line by counting a number of pulses of the input clock signal.

To improve a reliability of a semiconductor device, a memory cell array is formed in a product region of an SOI substrate, and a test cell array is formed in a scribe region of the SOI substrate. A plurality of regions is formed in each of the memory cell array and the test cell array. The plurality of regions formed in the test cell array is the same configuration as the plurality of regions formed in the memory cell array. A plurality of plugs is formed in the plurality of regions, respectively. Also, it can determine whether or not a leak path is occurred in the memory cell array, by inspecting whether or not a conduction between the plurality of plugs is confirmed.

An electronic device including a semiconductor memory. The semiconductor memory may include a cell array including a plurality of resistive storage cells; a current code generation block suitable for generating a current code which has a value corresponding to an average value of current amounts of test currents respectively flowing through at least two first resistive storage cells among the plurality of resistive storage cells, in a test operation; and a sensing block suitable for comparing a read current flowing through a second resistive storage cell selected among the plurality of resistive storage cells with a reference current, and thereby sensing data of the second resistive storage cell, wherein the semiconductor memory is operable to adjust a current amount of at least one current flowing through the sensing block based on the value of the current code.

Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. Groups of cells may be operated in different ways depending, for example, on a relationship between cell plates of the group of cells, pages of cells, and/or sections of cells. Cells may be selected in pairs or in larger multiples in order to accommodate an electric current relationship (such as a short) between two or more cells within a group, a page, and/or a section. When performing an access based on a smaller page size, a larger page size of cells may be selected to accommodate a short between plates within the smaller page, the larger page, and/or a section of memory that includes the smaller page or the larger page.

A memory test system is disclosed that includes a memory integrated circuit (IC) and a memory functional tester. The memory IC includes a plurality of memory banks, where each memory bank includes a plurality of memory cells. The memory functional tester includes an adjustable voltage generator circuit, a read current measurement circuit, and a controller. The memory functional tester performs a write/read functional test on the memory bank over a number of write control voltages to determine a preferred write control voltage, where the preferred write control voltage is designated for use during subsequent write operations to the memory bank during an operational mode.

A memory cell includes a first anti-fuse element, a first select transistor, a second anti-fuse element, a second select transistor, and a sensing control circuit. The first anti-fuse element is coupled to an anti-fuse control line, and the first select transistor transmits a voltage between a first bit line and the first anti-fuse element according to a voltage on the word line. The second anti-fuse element is coupled to the anti-fuse control line. The second select transistor transmits a voltage between a second bit line and the second anti-fuse element according to the voltage on the word line. The sensing control circuit provides a discharging path to a system voltage terminal from the first select transistor or the second select transistor according to states of the first anti-fuse element and the second anti-fuse element during a read operation.

A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

Methods, systems, and devices for a current monitor for a memory device are described. A memory device may monitor potential degradation of memory cells on the device by monitoring the amount of current drawn by one or more memory cells. As the memory cells degrade, the current supplied to the memory cells may change (e.g., increase due to additional leakage current. The memory device may indirectly monitor changes in the current supplied to the memory cells by monitoring a voltage of a node of a transistor that controls the amount of current supplied to the array of memory cells. The voltage at the control node may be compared to a reference voltage to determine whether the two voltages differ by a threshold amount, indicating that the memory cells are drawing more current. The memory device may output a status indicator when the voltages differ, for example, by the threshold amount.

Configurable input blocks and output blocks and physical layouts are disclosed for analog neural memory systems that utilize non-volatile memory cells. An input block can be configured to support different numbers of arrays arranged in a horizontal direction, and an output block can be configured to support different numbers of arrays arranged in a vertical direction. Adjustable components are disclosed for use in the configurable input blocks and output blocks.